| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Cosmic Plastics, Inc. |
| Trademark: | Cosmic Epoxy |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | gxYo64_Cosmic-Epoxy-EH21.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
|---|
|
DESCRIPTION Cosmic EH21 is an iron filled epoxy molding compound which is supplied in a granular form. FEATURES This material flows easily under low pressure and provides good moldability. APPLICATIONS The material is good for EMI / RFI shielding, and can be either compression or transfer molded to fabricate core rods and to encapsulate surface mount and axial leaded inductors. This single molded compound eliminates the labor intensive over-under molding. |
| General Information | |
|---|---|
| Filler / Reinforcement |
|
| Features |
|
| Appearance |
|
| Forms |
|
| Processing Method |
|
| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Specific Gravity | 2.09 | g/cm³ | |
| Bulk Factor | 2.5 | ||
| Spiral Flow | 20.0 - 30.0 |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (5°C) | 17 | wk | |
| Post Cure Time (160°C) | 2.0 - 4.0 | hr |
| Additional Information |
|---|
| Inductance Ls (µH) : 0.073 - 0.083Quality Factor : 1.2 - 1.5 |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Processing (Melt) Temp | 130 - 180 | °C | |
| Injection Pressure | 0.345 - 5.52 | MPa |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| SLOVALEN® PH 66 GF 30 FRO 4 | Plastcom | PP Homopolymer | SLOVALEN® |
| SUNPRENE® FE60JB | Mitsubishi Chemical Performance Polymers, Inc. | PVC Elastomer | SUNPRENE® |
| TORZEN® G3500HSL BK20 | INVISTA Engineering Polymers | Nylon 66 | TORZEN® |
| LNP™ THERMOCOMP™ QF006 compound | SABIC Innovative Plastics | Nylon 610 | LNP™ THERMOCOMP™ |
| Hostacom CA199AC BLK | LyondellBasell Industries | TPO (POE) | Hostacom |