TUFLIN™ HS-7094 NT 7

Category: LLDPE , Linear Low Density Polyethylene Resin
Manufacturer: The Dow Chemical Company
Trademark: TUFLIN™
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: zmZV3G_TUFLIN-HS-7094-NT-7.pdf
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Message
TUFLIN™ HS-7094 NT 7 Linear Low Density Polyethylene Resin is a fractional melt, ethylene-hexene copolymer, linear low density (LLDPE) resin designed for good toughness and stiffness. This product is recommended for thin and thick gauge applications such as trash bags and heavy-duty shipping sacks that require strength and output.

  • Hexene Linear Low Density Resin
  • Good Strength and Stiffness
  • Good Processability at Narrow Die Gaps
  • Complies with U.S. FDA 21 CFR 177.1520 (c) 3.2a
  • Consult the regulations for complete details.
General Information
Additive
  • Processing aid
  • Anti-caking agent (6000 ppm)
Agency Ratings
  • FDA 21 CFR 177.1520(c) 3.2a
Forms
  • Particle
Processing Method
  • Blow film
PhysicalNominal ValueUnitTest Method
Specific Gravity 0.930g/cm³ASTM D792
Melt Mass-Flow Rate (MFR) (190°C/2.16 kg)0.80g/10 minASTM D1238
FilmsNominal ValueUnitTest Method
Film Puncture Energy Internal method
    20 µm 1.47JInternal method
    51 µm 3.16JInternal method
Film Puncture Force Internal method
    20 µm 31.1NInternal method
    51 µm 66.7NInternal method
Film Puncture Resistance Internal method
    20 µm 8.36J/cm³Internal method
    51 µm 7.03J/cm³Internal method
Film strength ASTM D882
    MD : 20 µm 300J/cm³ASTM D882
    MD : 51 µm 337J/cm³ASTM D882
    TD : 20 µm 344J/cm³ASTM D882
    TD : 51 µm 357J/cm³ASTM D882
secant modulus ASTM D882
    2% secant, MD : 20 µm 302MPaASTM D882
    2% secant, MD : 51 µm 290MPaASTM D882
    2% secant, TD : 20 µm 327MPaASTM D882
    2% secant, TD : 51 µm 322MPaASTM D882
Tensile Strength ASTM D882
    MD : Yield, 20 µm 16.1MPaASTM D882
    MD : Yield, 51 µm 15.2MPaASTM D882
    TD : Yield, 20 µm 16.5MPaASTM D882
    TD : Yield, 51 µm 16.4MPaASTM D882
    MD : Break, 20 µm 59.7MPaASTM D882
    MD : Fracture, 51 µm 53.4MPaASTM D882
    TD : Break, 20 µm 44.6MPaASTM D882
    TD : Fracture, 51 µm 47.5MPaASTM D882
Tensile Elongation ASTM D882
    MD : Break, 20 µm 570%ASTM D882
    MD : Fracture, 51 µm 740%ASTM D882
    TD : Break, 20 µm 840%ASTM D882
    TD : Fracture, 51 µm 850%ASTM D882
Dart Drop Impact
    20 µm 52gASTM D1709A
    20 µm < 100gASTM D1709B
    51 µm 170gASTM D1709A
    51 µm < 100gASTM D1709B
Elmendorf Tear Strength 1ASTM D1922
    MD : 20 µm 170gASTM D1922
    MD : 51 µm 590gASTM D1922
    TD : 20 µm 800gASTM D1922
    TD : 51 µm 1300gASTM D1922
Seal Initiation Temperature 2Internal method
    20 µm 120°CInternal method
    51 µm 130°CInternal method
ThermalNominal ValueUnitTest Method
Vicat Softening Temperature 114°CASTM D1525
Melting Temperature (DSC) 126°CInternal method
OpticalNominal ValueUnitTest Method
Gloss ASTM D2457
    20°, 20.3 µm 23ASTM D2457
    20°, 50.8 µm 26ASTM D2457
    45°, 20.3 µm 43ASTM D2457
    45°, 50.8 µm 44ASTM D2457
Haze ASTM D1003
    20.3 µm 18%ASTM D1003
    50.8 µm 21%ASTM D1003
Additional InformationNominal ValueUnitTest Method
Seal Strength 3Internal method
    160°C, 20.3 µm 1500gInternal method
    170°C, 50.8 µm 2600gInternal method
ExtrusionNominal ValueUnit
Melt Temperature 233°C
Extrusion instructions
Fabrication Conditions For Blown Film: Screw Size: 2.5 in. (63.5 mm) 30:1 L/D Screw Type: DSBII Die Gap: 70 mil (1.8 mm) Melt Temperature: 451 °F (233 °C) Output: 10 lb/hr/in. of die circumference Die Diameter: 6 in. Blow-Up Ratio: 2.5 to 1 Screw Speed: 78 rpm Frost Line Height: 25 in. (635 mm)
Note Message
1 .Method B
2 .Temperature at which 1 lb/in. (4.4 N/25.4 mm) heat seal strength is achieved.Heat Seal Strengths, Topwave HT Tester 0.5 S dwell, 40 psi bar pressure, pull speed 10 (in./min.).
3 .Heat Seal Strengths, Topwave HT Tester 0.5 S dwell, 40 psi bar pressure, pull speed 10 (in./min.).
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