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EPO-TEK® EE149-6
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | zmTIe6_EPO-TEK-EE149-6.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing. |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 4 | ppm | |
| K+ | 5 | ppm | |
| Na+ | 8 | ppm | |
| NH4+ | 10 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 380 | °C | |
| Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 3.77 | GPa | |
| Thixotropic Index | 4.70 | ||
| Weight Loss on Heating | |||
| 250°C | 0.050 | % | |
| 300°C | 0.16 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 130 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.4E-5 | cm/cm/°C | |
| -- 3 | 1.1E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.98 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 26 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Silver | ||
| Density | 3.26 | g/cm³ | |
| Viscosity 4(23°C) | 2.0 to 4.0 | Pa·s | |
| Curing Time | |||
| 70°C 5 | 0.17 | hr | |
| 180°C | 1.0 | hr | |
| Pot Life | 36000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 74 | ||
| Lap Shear Strength (23°C) | 3.78 | MPa | |
| Volume Resistivity (23°C) | < 5.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-300°C/ISO 25 Min; Ramp -10-300°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 100 rpm |
| 5 . | B-stage |
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