FM® 309-1

Category: Adhesive , Adhesive
Manufacturer: Cytec Industries Inc.
Trademark: FM®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: yKkIQM_FM-309-1.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
FM® 309-1 a next generation adhesive film for bonding composite and metallic structures. This new film provides a unique combination of high Tg [182°C (360°F)], high toughness and higher temperature shear properties. FM 309-1 is designed for co-cure, co-bond or secondary bonding applications and is compatible with most 177°C (350°F) curing epoxy-based prepreg systems. This new film has excellent resistance to pre-bond and post-bond humidity and has a service temperature of 177°C (350°F). FM 309-1 adhesive film provides excellent handling properties (good tack and drape) and has a minimum shop life of 30 days at 24°C (75°F). FM 309-1 adhesive can be supplied as a supported (woven glass, knit or mat carrier) or unsupported film at various weights and thicknesses. For co-cure or co-bond applications, adhesive film weight of 147 - 244 gsm (0.030 - 0.050 psf) with mat carrier is recommended. This adhesive film is suitable for bonding of monolithic or sandwich structures. Honeycomb sandwich panels manufactured using FM 309-1 adhesive film demonstrate excellent laminate quality (void content <1%) and very good filleting. FM 309-1 adhesive film can be cured at 177°C (350°F) in 90 minutes at 0.28 MPa (40 psi) or can also be cured under vacuum-only pressure. The performance after vacuum cure is comparable to that after pressure cure.

Suggested Applications:
Bonding of composite and metallic structures
Co-cure, co-bond and secondary bonding applications
General Information
Features
  • Good Adhesion
  • Good Toughness
Uses
  • Adhesives
  • Bonding
  • Laminates
Appearance
  • Red
Forms
  • Film
PhysicalNominal ValueUnit
Specific Gravity 1.12g/cm³
Additional InformationNominal ValueUnit
Volatiles < 1.0%
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