Plaskon S-7 Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is a state-of-the-art, low stress epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It offers end users superior value-in-use due to a balanced mix of properties.

General Information
Features	Semi-conductive Laser marking Good formability Excellent appearance
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.82	g/cm³	ASTM D792
Molding Shrinkage - Flow	0.37	%	ASTM D955

Mechanical	Nominal Value	Unit	Test Method
Tensile Strength	0.00621	MPa	ASTM D638
Flexural Modulus	1.24	MPa	ASTM D790
Flexural Strength (21°C)	0.0103	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	150	°C	ASTM E1356
CLTE - Flow	1.7E-5	cm/cm/°C	ASTM D696
Thermal Conductivity	16	W/m/K	ASTM C177

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	5.0E+15	ohms·cm	ASTM D257
Dielectric Strength	16	kV/mm	ASTM D149
Dielectric Constant (1 kHz)	3.80		ASTM D150
Dissipation Factor (1 kHz)	2.0E-3		ASTM D150
Arc Resistance	180	sec	ASTM D495

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94
Oxygen Index	32	%	ASTM D2863

Additional Information
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 85 to 115 cmAutomatic Orifice Viscosity, 175°C, 1000 psi, 1 mm die length, 1/2 mm diameter: 17 Pascal secRam Follower Gel Time, 177°C: 13 to 21 secAsh Content: 73.4 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 90 sec, 175°C: 75Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 17 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 45 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 85 to 115 cmAutomatic Orifice Viscosity, 175°C, 1000 psi, 1 mm die length, 1/2 mm diameter: 17 Pascal secRam Follower Gel Time, 177°C: 13 to 21 secAsh Content: 73.4 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 90 sec, 175°C: 75Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 17 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 45 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Preheat Temperature: 85 to 95°C Molding Temperature: 170 to 185°C Molding Pressure: 900 to 1200 psi Cure Time, 177°C: 1 to 2min Post Mold Cure Time, 175°C: 4 to 12 hr

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	wnv8x6_Plaskon-S-7.pdf
PRICE:	Order Products email sales@su-jiao.com

Resin Grade	Manufacturer	Category	Trademark
Styrolution PS 495N	INEOS Styrolution Group GmbH	PS (HIPS)	Styrolution PS
TUFNYL® SGF 40 BLACK	SRF Ltd.	Nylon 6	TUFNYL®
ZEONEX® 330R	Zeon Corporation	COC	ZEONEX®
EZPrene 9050D	ENPLAST Americas, a Ravago Group Company	TPV	EZPrene
Huafon JF-A-AH2060	Huafon Group Co., Ltd.	PUR, Unspecified	Huafon