EPO-TEK® ED1021

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: uT7HW8_EPO-TEK-ED1021.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its ability to achieve high thermal conductivity values at low cure temperatures and a very shiny silver appearance which enhances overall LED brightness. Other benefits include long pot-life, low viscosity and high thixotropy makng it ideal for wafer level stamping as well as syringe dispensing.

Formerly 77-190-2
General Information
Filler / Reinforcement
  • Silver
Features
  • Low Viscosity
  • Thermally Conductive
  • Thixotropic
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • LEDs
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- < 10ppm
    K+ 1ppm
    Na+ 3ppm
    NH4+ 9ppm
Particle Size < 20.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 403°C
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 178MPa
Thixotropic Index 4.20
Weight Loss on Heating
    200°C 0.35%
    250°C 0.41%
    300°C 0.56%
ThermalNominal ValueUnit
Glass Transition Temperature 48.0°C
CLTE - Flow
    -- 15.2E-5cm/cm/°C
    -- 21.8E-4cm/cm/°C
Thermal Conductivity 3.3W/m/K
ThermosetNominal ValueUnit
Shelf Life (-40°C)52wk
Uncured PropertiesNominal ValueUnit
Color Silver
Density 2.79g/cm³
Viscosity
    23°C 31.8Pa·s
    23°C 48.8Pa·s
    23°C 537Pa·s
Curing Time (125°C)1.0hr
Pot Life 130000min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)82
Volume Resistivity 2.0E-4ohms·cm
Note Message
1 .Below Tg
2 .Above Tg
3 .100 rpm
4 .10 rpm
5 .1 rpm
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