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Edgetek™ PF-05GF/000 FR MR
| Category: | PSU , Polysulfone |
| Manufacturer: | PolyOne Corporation |
| Trademark: | Edgetek™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | uMadbY_Edgetek-PF-05GF-000-FR-MR.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| The Edgetek® Engineering Thermoplastic Compounds portfolio covers a broad range of standard and custom-formulated high performance materials. This portfolio includes high-temperature materials for elevated service temperature environments, high-modulus / structural materials for load-bearing and high-strength applications and flame-retardant products. These compounds are based on select engineering thermoplastic resins that are compounded with reinforcing additives such as carbon fiber, glass fiber and glass beads. |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.30 | g/cm³ | ASTM D792 |
| Molding Shrinkage - Flow | 0.40 to 0.60 | % | ASTM D955 |
| Water Absorption (24 hr, 3.18 mm) | 0.50 | % | ASTM D570 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus 1 | 3100 | MPa | ASTM D638 |
| Tensile Strength 2(Yield) | 68.9 | MPa | ASTM D638 |
| Tensile Elongation 3(Break) | 10 | % | ASTM D638 |
| Flexural Modulus | 103 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C, 3.18 mm, Injection Molded) | 59 | J/m | ASTM D256A |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.18 mm) | 166 | °C | ASTM D648 |
| Flammability | Nominal Value | Test Method | |
|---|---|---|---|
| Flame Rating | V-0 | UL 94 |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 135 to 149 | °C | |
| Drying Time | 2.0 | hr | |
| Processing (Melt) Temp | 343 to 382 | °C | |
| Mold Temperature | 135 to 149 | °C |
| Note Message | |
|---|---|
| 1 . | Type I, 5.1 mm/min |
| 2 . | Type I, 5.1 mm/min |
| 3 . | Type I, 5.1 mm/min |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Delta IPP 5004 | Delta Polymers | PP Copolymer | Delta |
| EPO-TEK® H20E-HC | Epoxy Technology Inc. | Epoxy | EPO-TEK® |
| HiFill® PC/PBT IM 5220 LE | Techmer Engineered Solutions | PC+PBT | HiFill® |
| Huafon JF-S-HS96 | Huafon Group Co., Ltd. | PUR, Unspecified | Huafon |
| LOXIM 100 00 V0 | LOXIM Industries Private Limited | PC | LOXIM |
