Devcon Metal Welder™

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Devcon
Trademark: Devcon
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: tMlwaS_Devcon-Metal-Welder-.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Fast curing 10:1 methacrylate adhesive designed for structural bonding of metals without primers. The system requires little to no surface preparation or primers.

Intended Use:
  • Structural bonding of aluminum, steel, and stainless steel, along with bonding thermoplastic and composite assemblies.

Features:
  • Excellent environmental resistance
  • Low odor technology
  • Bonds dissimilar substrates
  • Excellent impact, peel, and shear resistance
  • Beads in activator for proper bond line thickness
General Information
Features
  • Impact resistance, high
  • Adhesiveness
  • Fast curing
  • The smell is low to none
Uses
  • Metal bonding
  • Bonding
  • Adhesive
Appearance
  • Grey
PhysicalNominal ValueUnitTest Method
Density 0.979g/cm³
HardnessNominal ValueUnitTest Method
Durometer Hardness (Shore D)75ASTM D2240
MechanicalNominal ValueUnit
Tensile Elongation (Break)30 - 60%
ImpactNominal ValueUnit
Impact Resistance
    -- > 42.0kJ/m²
    AL : -40°C 31.5kJ/m²
ThermalNominal ValueUnit
Service Temperature -55 - 93°C
ThermosetNominal ValueUnitTest Method
Work Time (22°C) 4.0 - 6.0min
Additional InformationNominal ValueUnitTest Method
Tensile Shear Adhesion ASTM D1002
    14 day salt fog AL 15.2MPaASTM D1002
    ABS 8.62MPaASTM D1002
    AL 17.6MPaASTM D1002
    Composite 9.65MPaASTM D1002
    GBS 16.9MPaASTM D1002
    SS 18.0MPaASTM D1002
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Component a Mixing ratio by weight: 8.7 Mixing ratio by capacity: 10
    Component B Mixing ratio by weight: 1.0 Mixing ratio by capacity: 1.0
Thermoset Mix Viscosity 90000cP
Additional InformationNominal ValueUnitTest Method
Cured 7 days @ 75°F
Uncured PropertiesNominal ValueUnitTest Method
Curing Time (22°C)24hr
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