Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Generic |
Trademark: | Generic |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | sptWq5_Generic-Epoxy---Glass-Mineral.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
---|
This data represents typical values that have been calculated from all products classified as: Generic Epoxy - Glass\Mineral This information is provided for comparative purposes only. |
General Information | |
---|---|
Filler / Reinforcement |
|
Physical | Nominal Value | Unit | Test Method |
---|---|---|---|
Specific Gravity | 1.84 to 2.02 | g/cm³ | ASTM D792 |
Molding Shrinkage - Flow (23°C) | 0.25 to 0.50 | % | ASTM D955 |
Mechanical | Nominal Value | Unit | Test Method |
---|---|---|---|
Flexural Modulus (23°C) | 13700 to 16700 | MPa | ASTM D790 |
Compressive Strength (23°C) | 193 to 237 | MPa | ASTM D695 |
Impact | Nominal Value | Unit | Test Method |
---|---|---|---|
Notched Izod Impact (23°C) | 16 to 27 | J/m | ASTM D256 |
Thermal | Nominal Value | Unit | Test Method |
---|---|---|---|
Deflection Temperature Under Load (1.8 MPa, Unannealed) | 135 to 282 | °C | ASTM D648 |
Thermal Conductivity (23°C) | 0.65 to 0.71 | W/m/K | ASTM C177 |
Electrical | Nominal Value | Unit | Test Method |
---|---|---|---|
Dielectric Strength (23°C) | 13 to 15 | kV/mm | ASTM D149 |
Dielectric Constant (23°C) | 3.89 to 4.80 | ASTM D150 | |
Dissipation Factor (23°C) | 0.010 to 0.014 | ASTM D150 |
Resin Grade | Manufacturer | Category | Trademark |
---|---|---|---|
Spartech Polycom PP5140F D30 | Spartech Polycom | PP, Unspecified | Spartech |
Elastron® G G400.A90.N | Elastron USA, Inc. | SEBS | Elastron® G |
LNP™ THERMOCOMP™ DF004 compound | SABIC Innovative Plastics | PC | LNP™ THERMOCOMP™ |
PHOENIX™ 12451 | Phon Tech Industrial Company | TPE | PHOENIX™ |
PLUSTEK RA320G3 | Polyram Ram-On Industries | Nylon 66 | PLUSTEK |