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Devcon Plastic Steel® 5-Minute® Putty (SF)
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Devcon |
| Trademark: | Devcon |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | scz6ZL_Devcon-Plastic-Steel-5-Minute-Putty-SF-.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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A steel-filled, fast-setting epoxy putty for filling, rebuilding, and bonding metal surfaces. Intended Use:
Product features:
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| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Appearance |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 2.20 | g/cm³ | |
| Specific Volume | 0.441 | cm³/g | |
| Solid content- by Volume | 100 | % |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Temperature Resistance - Dry | 93 | °C | |
| Tensile Shear Adhesion | 14.0 | MPa | ASTM D1002 |
| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Molding Shrinkage - Flow | 0.060 | % | ASTM D2566 |
| Hardness | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Durometer Hardness (Shore D) | 85 | ASTM D2240 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus | 5170 | MPa | ASTM D638 |
| Flexural Strength | 53.0 | MPa | ASTM D790 |
| Compressive Strength | 71.7 | MPa | ASTM D695 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| CLTE - Flow | 6.1E-5 | cm/cm/°C | ASTM D696 |
| Thermal Conductivity | 1.1 | W/m/K | ASTM C177 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Dielectric Strength | 1.2 | kV/mm | ASTM D149 |
| Dielectric Constant | 35.0 | ASTM D150 |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Component a | Mixing ratio by weight: 1.7 Mixing ratio by capacity: 1.0 | ||
| Component B | Mixing ratio by weight: 1.0 Mixing ratio by capacity: 1.0 | ||
| Pot Life (24°C) | 5.0 | min |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Cured 7 days @ 75°F |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Curing Time | 1.0 | hr |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RheTech Polypropylene T20P104-334 | RheTech, Inc. | PP, Unspecified | RheTech Polypropylene |
| RheTech Thermoplastic Polyolefin FT4900-659UV | RheTech, Inc. | Polyolefin, Unspecified | RheTech Thermoplastic Polyolefin |
| Shinko-Lac® ABS GL-4 | Mitsubishi Rayon America Inc. | ABS | Shinko-Lac® |
| Nanjing Hongrui PC CT306 | Nanjing Hongrui Engineering Plastics Co., Ltd. | PC Alloy | Nanjing Hongrui PC |
| Paracril® C | INSA | NBR | Paracril® |
