Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | sKc05L_EPO-TEK-E2001-6.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® E2001-6 is a two component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a two component version of EPO-TEK® E3001-6. |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | 103 | ppm | |
K+ | 1 | ppm | |
Na+ | 14 | ppm | |
NH4+ | 26 | ppm | |
Particle Size | < 20.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 425 | °C | TGA |
Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
Operating Temperature | |||
Continuous | -55 to 250 | °C | |
Intermittent | -55 to 350 | °C | |
Storage Modulus | 4.88 | GPa | |
Thixotropic Index | 2.40 | ||
Weight Loss on Heating | |||
200°C | 0.17 | % | |
250°C | 0.20 | % | |
300°C | 0.28 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 100 | °C | |
CLTE - Flow | |||
-- 2 | 5.0E-5 | cm/cm/°C | |
-- 3 | 1.1E-4 | cm/cm/°C | |
Thermal Conductivity | 1.5 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 100 | ||
Part B | Mix Ratio by Weight: 2.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | |||
-- 4 | Amber | ||
-- 5 | Silver | ||
Density | |||
Part B | 0.968 | g/cm³ | |
Part A | 2.69 | g/cm³ | |
Viscosity 6(23°C) | 5.5 to 7.5 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 480 | min |
Cured Properties | Nominal Value | Unit | Test Method |
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Shore Hardness (Shore D) | 83 | ||
Lap Shear Strength (23°C) | 7.99 | MPa | |
Volume Resistivity | |||
23°C | < 5.0E-4 | ohms·cm | |
23°C 7 | 2.0E-3 | ohms·cm |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part B |
5 . | Part A |
6 . | 50 rpm |
7 . | 150°C/5 min cure |
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