EPO-TEK® E2001-6

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: sKc05L_EPO-TEK-E2001-6.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® E2001-6 is a two component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a two component version of EPO-TEK® E3001-6.
General Information
Features
  • Electrically Conductive
  • Good Adhesion
  • Thermally Conductive
Uses
  • Electrical/Electronic Applications
  • Printed Circuit Boards
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- 103ppm
    K+ 1ppm
    Na+ 14ppm
    NH4+ 26ppm
Particle Size < 20.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 425°CTGA
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 250°C
    Intermittent -55 to 350°C
Storage Modulus 4.88GPa
Thixotropic Index 2.40
Weight Loss on Heating
    200°C 0.17%
    250°C 0.20%
    300°C 0.28%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 100°C
CLTE - Flow
    -- 25.0E-5cm/cm/°C
    -- 31.1E-4cm/cm/°C
Thermal Conductivity 1.5W/m/K
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 100
    Part B Mix Ratio by Weight: 2.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color
    -- 4Amber
    -- 5Silver
Density
    Part B 0.968g/cm³
    Part A 2.69g/cm³
Viscosity 6(23°C)5.5 to 7.5Pa·s
Curing Time (150°C)1.0hr
Pot Life 480min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)83
Lap Shear Strength (23°C)7.99MPa
Volume Resistivity
    23°C < 5.0E-4ohms·cm
    23°C 72.0E-3ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .50 rpm
7 .150°C/5 min cure
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