KumhoSunny PC HCG2510MP

Category: PC , Polycarbonate
Manufacturer: Shanghai KumhoSunny Plastics Co., Ltd.
Trademark: KumhoSunny PC
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: rwp7M6_KumhoSunny-PC-HCG2510MP.pdf
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HCG2510MP is high rigidity and high tenacity 10%GF PC resin. It has high stability and super shape resistance property. HCG2510MP is mainly used in mobile phone housing, etc.
General Information
Filler / Reinforcement
  • Glass Fiber, 10% Filler by Weight
Features
  • Good Stability
  • High Rigidity
Uses
  • Cell Phones
  • Housings
UL File Number
  • E254819
Forms
  • Pellets
Processing Method
  • Injection Molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.25g/cm³ASTM D792
Melt Mass-Flow Rate (MFR) (300°C/1.2 kg)20g/10 minASTM D1238
Molding Shrinkage - Flow 0.20 to 0.40%ASTM D955
MechanicalNominal ValueUnitTest Method
Tensile Strength 59.0MPaASTM D638
Tensile Elongation (Break)9.0%ASTM D638
Flexural Modulus 3250MPaASTM D790
Flexural Strength 98.0MPaASTM D790
ImpactNominal ValueUnitTest Method
Notched Izod Impact (3.20 mm)140J/mASTM D256
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed)135°CASTM D648
ElectricalNominal ValueUnitTest Method
Surface Resistivity > 1.0E+15ohmsIEC 60093
Volume Resistivity > 1.0E+15ohms·cmIEC 60093
InjectionNominal ValueUnit
Drying Temperature 100 to 120°C
Drying Time 3.0 to 4.0hr
Suggested Max Moisture 0.020%
Rear Temperature 250 to 270°C
Middle Temperature 260 to 280°C
Front Temperature 280 to 300°C
Nozzle Temperature 280 to 290°C
Processing (Melt) Temp 290 to 300°C
Mold Temperature 100 to 140°C
Back Pressure 0.300 to 1.00MPa
Screw Speed 20 to 100rpm
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