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EPO-TEK® H70E-TI
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | qLVlRa_EPO-TEK-H70E-TI.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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A two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronic applications. Formerly 93-84 |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 410 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus | 3.78 | GPa | |
| Thixotropic Index | 1.80 | ||
| Weight Loss on Heating | |||
| 200°C | 0.17 | % | |
| 250°C | 0.90 | % | |
| 300°C | 2.3 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 65.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.6E-5 | cm/cm/°C | |
| -- 3 | 1.9E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.60 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Cream | ||
| -- 5 | Cream | ||
| Density | |||
| Part A | 1.33 | g/cm³ | |
| Part B | 2.06 | g/cm³ | |
| Viscosity 6(23°C) | 2.1 to 3.0 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | < 2900 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 75 | ||
| Lap Shear Strength (23°C) | 9.72 | MPa | |
| Relative Permittivity (1 kHz) | 4.23 | ||
| Volume Resistivity (23°C) | > 5.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 4.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 100 rpm |
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|---|---|---|---|
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| Sinvicomp SBC3715 | Teknor Apex Asia Pacific PTE. LTD. | PVC, Rigid | Sinvicomp |
| Ultra Low Outgassing™ SCV-2596 | NuSil Technology | Silicone | Ultra Low Outgassing™ |
| Geon™ Duracap™ L4605 Ivory 3098 | PolyOne Corporation | PVC, Semi-Rigid | Geon™ Duracap™ |
