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Plaskon NXG-1LAR
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Cookson Electronics - Semiconductor Products |
| Trademark: | Plaskon |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | qDlH1o_Plaskon-NXG-1LAR.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| This material is an epoxy molding compound for high temperature, lead-free reflow in low alpha applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a "green" compound with no halogens and a lower Tg than multifunctional materials. |
| General Information | |
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| Features |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 2.00 | g/cm³ | ASTM D792 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flexural Modulus | ASTM D790 | ||
| 22°C | 2.45 | MPa | ASTM D790 |
| 260°C | 0.0686 | MPa | ASTM D790 |
| Flexural Strength | ASTM D790 | ||
| 22°C | 0.0123 | MPa | ASTM D790 |
| 260°C | 8.14E-4 | MPa | ASTM D790 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Glass Transition Temperature | 150 | °C | ASTM E1356 |
| CLTE - Flow | 9.0E-6 | cm/cm/°C | ASTM D696 |
| Thermal Conductivity | 0.70 | W/m/K | ASTM C177 |
| Flammability | Nominal Value | Test Method | |
|---|---|---|---|
| Flame Rating (3.18 mm) | V-0 | UL 94 |
| Additional Information |
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| Recommended Storage Temperature: <5°CLife @ 5°C: 6 monthsLife @ 22°C: 2 daysLife @ 35°C: 0.5 daysSpiral Flow, 175°C, 1000 psi: 132 cmShimadzu Viscosity, 175°C, 1000 psi: 55 poiseRam Follower Gel Time, 175°C, 1000 psi: 18 secAsh Content: 88.6 %Hydrolyzable Halides: <1 ppmAlpha Particle Count: <0.002 counts/cm²/hrMoisture Absorption, 85°C/85%RH, 168 hrs: 0.275%Cull Hot Hardness, Shore D: 75All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 35 cm^-6/cm/°C |
| Injection instructions |
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| Resin Transfer Molding: Molding Temperature: 165 to 185°C Molding Pressure: 1000 psi In Mold Cure Time: 50 to 100 sec Post Mold Cure Time, 175°C: 0 to 2 hr |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 227 HS | RTP Company | Nylon 66 | RTP |
| RTP 300 TFE 15 SE | RTP Company | PC | RTP |
| Ravaflex SBR 1712 | Ravago Group | SBR, Unspecified | Ravaflex |
| NEO-ZEX™ 2540R | Prime Polymer Co., Ltd. | LLDPE | NEO-ZEX™ |
| KPOL-HDPE HD K-0.35/955 | KPOL Chem Co. | HDPE | KPOL-HDPE |
