Order Products : sales@su-jiao.com

KYOCERA KE-850SH

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	KYOCERA Chemical Corporation
Trademark:	KYOCERA
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	pzzKxo_KYOCERA-KE-850SH.pdf
PRICE:	Order Products email sales@su-jiao.com

Wechat: WECHAT

WECHAT

Message

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound.

Strong Points

High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress.

Used in Auto Molding System by Rapid Cure Grades.

KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K).

Application

Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics.

Packages for High Heating Volume such as Power Module.

General Information
Features	Good Moldability Moisture Resistant Thermally Conductive
Uses	Electrical/Electronic Applications

Physical	Nominal Value	Unit
Specific Gravity	2.19	g/cm³
Spiral Flow	35.0	cm

Thermal	Nominal Value	Unit
Glass Transition Temperature	175	°C
CLTE - Flow
-- ¹	2.2E-5	cm/cm/°C
-- ²	5.9E-5	cm/cm/°C
Thermal Conductivity	2.3	W/m/K

Uncured Properties	Nominal Value	Unit
Gel Time	0.42	min

Note Message
1 .	Alpha 1
2 .	Alpha 2

Resin Grade	Manufacturer	Category	Trademark
SLOVAMID® 66 W 40	Plastcom	Nylon 66	SLOVAMID® 66
SUNPRENE® FG60FA	Mitsubishi Chemical Performance Polymers, Inc.	PVC Elastomer	SUNPRENE®
Next Nylon 66 Prime Series PX-01BK	Next Polymers Ltd.	Nylon 66	Next Nylon 66 Prime Series
POLYfill PPC K20040	Polykemi AB	PP Copolymer	POLYfill
RTP 199 X 143685 A	RTP Company	PP, Unspecified	RTP