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BCC Resins BC 7062-3H
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | BCC Products Inc. |
| Trademark: | BCC Resins |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | pHbD9g_BCC-Resins-BC-7062-3H.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| BC 7062 are aluminum filled, low viscosity epoxy mass casting resins. These room temperature cure systems allow the user choice thicknesses of 1/8 inch to a maximum of 6 inches without foaming or yielding excessive shrinkage. Casting thicknesses may be increased by incorporating aluminum needles, puffs or granules. BC 7062, when properly cured, provides nearly perfect reproduction, resulting in a dimensionally stable, hard, tough surface. For use in constructing duplicate models, prototypes, patterns, facing dies, etc. |
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| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Hardener | Mix Ratio by Weight: 1.0, Mix Ratio by Volume: 1.0 | ||
| Resin | Mix Ratio by Weight: 6.0, Mix Ratio by Volume: 2.9 | ||
| Pot Life 1(24°C) | > 240 | min | |
| Thermoset Mix Viscosity 2(24°C) | 3800 | cP | ASTM D2393 |
| Demold Time | > 2900 | min | |
| Post Cure Time | |||
| 24°C | 120 | hr | |
| 66°C | 3.0 to 4.0 | hr |
| Additional Information | Nominal Value | Unit | Test Method |
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| Casting Thickness | 2.00 to 6.00 |
| Note Message | |
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| 1 . | 2 lb mass |
| 2 . | Brooksfield |
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| Geon™ Vinyl Rigid Molding M3900 | PolyOne Corporation | PVC, Rigid | Geon™ Vinyl Rigid Molding |
| Plaskon CMU-870-2B | Cookson Electronics - Semiconductor Products | Epoxy | Plaskon |
| Plaskon SMT-B-1LV | Cookson Electronics - Semiconductor Products | Epoxy | Plaskon |
