Vyncolit® 52-01

Category: DAP , Diallyl Phthalate
Manufacturer: Vyncolit N.V.
Trademark: Vyncolit®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: oi81ug_Vyncolit-52-01.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
Vyncolit 52-01 is a diallyl phthalate (DAP) material, and the filler is glass fiber reinforced material. This product is available in North America, Africa and the Middle East, Latin America, Europe or Asia Pacific. The processing methods are: resin transfer molding, compression molding or injection molding.

The main features of Vyncolit 52-01 are:
  • chemical resistance
  • Good dimensional stability
  • moisture resistance
  • Impact resistance
  • Wear-resistant

Typical application areas include:
  • Electrical/electronic applications
  • Wire and cable
  • Aerospace
  • military applications
General Information
Filler / Reinforcement
  • Glass fiber reinforced material
Features
  • Good dimensional stability
  • Moisture resistance
  • Antibacterial property
  • Solvent resistance
  • Impact resistance, high
  • Good electrical performance
  • Good chemical resistance
  • alkali resistance
  • Good wear resistance
  • Fuel resistance
  • Heat resistance, high
  • acid resistance
Uses
  • Membrane key switch
  • Aircraft applications
  • Insulating material
  • Connector
  • Communication Equipment
Agency Ratings
  • MIL C-24308
Forms
  • Particles
Processing Method
  • Resin transfer molding
  • Compression molding
  • Injection molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.93g/cm³ASTM D792
Bulk Factor 2.3ASTM D1895
Molding Shrinkage - Flow (Compression Molded)0.20 - 0.40%ASTM D955
MechanicalNominal ValueUnitTest Method
Tensile Strength 68.9MPaASTM D638
Flexural Modulus 11700MPaASTM D790
Flexural Strength 110MPaASTM D790
Compressive Strength 131MPaASTM D695
ImpactNominal ValueUnitTest Method
Notched Izod Impact 32J/mASTM D256A
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed)204°CASTM D648
CLTE - Flow 2.1E-5cm/cm/°CASTM D696
Thermal Conductivity 0.28W/m/KASTM C177
RTI Elec 130°CUL 746
RTI Imp 130°CUL 746
RTI 130°CUL 746
ElectricalNominal ValueUnitTest Method
Dielectric Strength ASTM D149
    -- 115kV/mmASTM D149
    -- 214kV/mmASTM D149
Dielectric Constant ASTM D150
    1 kHz 4.00ASTM D150
    1 MHz 3.50ASTM D150
Dissipation Factor ASTM D150
    1 kHz 0.010ASTM D150
    1 MHz 0.016ASTM D150
Arc Resistance 150secASTM D495
Comparative Tracking Index (CTI) 600VUL 746
FlammabilityNominal ValueUnitTest Method
Oxygen Index 26%ASTM D2863
InjectionNominal ValueUnit
Rear Temperature 60.0°C
Middle Temperature 76.7°C
Nozzle Temperature 87.8°C
Processing (Melt) Temp 110 - 116°C
Mold Temperature 160 - 182°C
Injection instructions
Plastication: 50rpmBack Pressure (gauge): slightInjection Pressure: set to give 5 to 15 sec injection timeHold Pressure: 1/2 of injection pressureCure Time, 0.125 in: 40 secThe value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM F433.Resin Isomer, DAP: OrthoWater Absorption, ASTM D570, 48 hrs, 50°C: 0.25%Dielectric Strength, ASTM D149, 60 Hz, Method A, wet: 375 V/milDielectric Strength, ASTM D149, 60 Hz, Method B, wet: 350 V/milDielectric Constant, ASTM D150, 1000 Hz, wet: 4Dielectric Constant, ASTM D150, 1000000 Hz, wet: 3.5Dissipation Factor, ASTM D150, 1000 Hz, wet: 0.01Dissipation Factor, ASTM D150, 1000000 Hz, wet: 0.016Compression and Transfer Molding Conditions: Preforming Pressure: 8000 to 12000 psi Preheat Temperature: 220 to 230 °F Preheat Time: 45 sec Mold Temperature: 320 to 350 °F Compression Mold Pressure: 3500 to 6000 psi Transfer Mold Pressure: 2500 to 5000 psi Cure Time, 0.125 in: 45 to 70 sec
Note Message
1 .Method A (short time)
2 .Method B (step by step)
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