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EPO-TEK® 360ST
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | oZZMlD_EPO-TEK-360ST.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a slightly thixotropic paste for non-flow properties. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 344 | °C | |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 175 | °C | |
| Intermittent | -55 to 275 | °C | |
| Storage Modulus (23°C) | 1.77 | GPa | |
| Thixotropic Index | 2.60 | ||
| Weight Loss on Heating | |||
| 200°C | 0.88 | % | |
| 250°C | 1.9 | % | |
| 300°C | 4.0 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 80.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 5.1E-5 | cm/cm/°C | |
| -- 3 | 2.2E-4 | cm/cm/°C |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 10 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Tan | ||
| Density | |||
| Part B | 1.02 | g/cm³ | |
| Part A | 1.03 | g/cm³ | |
| Viscosity 6(23°C) | 1.4 to 2.4 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 180 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 85 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 3.58 | ||
| Volume Resistivity (23°C) | > 1.8E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.012 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 100 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Wellamid® FR22F-N | Wellman Engineering Resins | Nylon 66 | Wellamid® |
| ASTALON™ S1000UR | Marplex Australia Pty. Ltd. | PC | ASTALON™ |
| Daelim Po1y® LD-01A | DAELIM INDUSTRIAL CO., LTD. | LDPE | Daelim Po1y® |
| ELASTOSIL® FLR 3900/60 A/B | Wacker Chemie AG | Silicone | ELASTOSIL® FLR |
| PLANAC BT-2200-60 | TOYOBO America, Inc. | PBT | PLANAC |
