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EPO-TEK® H55
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | o9eRxL_EPO-TEK-H55.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 10.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 465 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 3.77 | GPa | |
| Weight Loss on Heating | |||
| 200°C | 0.88 | % | |
| 250°C | 1.1 | % | |
| 300°C | 1.5 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 100 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.2E-5 | cm/cm/°C | |
| -- 3 | 7.9E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.40 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 20 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 26 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | White | ||
| Density | |||
| Part B | 1.06 | g/cm³ | |
| Part A | 1.69 | g/cm³ | |
| Viscosity 6(23°C) | 250 to 400 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 180 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 68 | ||
| Lap Shear Strength (23°C) | 11.5 | MPa | |
| Relative Permittivity (1 kHz) | 6.32 | ||
| Volume Resistivity (23°C) | > 1.2E+14 | ohms·cm | |
| Dissipation Factor (1 kHz) | 8.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 1 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 200 GB 50 | RTP Company | Nylon 66 | RTP |
| Anjacom® 455-GF30 | Almaak International GmbH | PBT | Anjacom® |
| Axpoly® PS01 3009 | Axion Polymers | PS (HIPS) | Axpoly® |
| Geon™ Vinyl Rigid Molding M5105 | PolyOne Corporation | PVC, Rigid | Geon™ Vinyl Rigid Molding |
| Huafon JF-W-3240 | Huafon Group Co., Ltd. | PUR, Unspecified | Huafon |
