Plaskon MUF-2B Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF Series is the total molded underfill solution for Flip Chip in Package.

General Information
Features	Semi-conductive Low warpage Workability, good
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.89	g/cm³	ASTM D792
Molding Shrinkage - Flow	5.0	%	ASTM D955

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus			ASTM D790
22°C	1.77	MPa	ASTM D790
215°C	0.588	MPa	ASTM D790
Flexural Strength			ASTM D790
22°C	0.00834	MPa	ASTM D790
215°C	0.00343	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	195	°C	ASTM E1356
CLTE - Flow	1.6E-5	cm/cm/°C	ASTM D696
Thermal Conductivity	0.75	W/m/K	ASTM C177

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	4.5E+15	ohms·cm	ASTM D257
Dielectric Strength	31	kV/mm	ASTM D149
Dielectric Constant (1 kHz)	3.13		ASTM D150
Dissipation Factor (1 kHz)	1.7E-3		ASTM D150

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94

Additional Information
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 125 cmShimadzu Viscosity, 175°C, 1000 psi: 50 poiseRam Follower Gel Time, 175°C, 1000 psi: 14 secAsh Content: 80 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D: 85All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 16 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 55 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 125 cmShimadzu Viscosity, 175°C, 1000 psi: 50 poiseRam Follower Gel Time, 175°C, 1000 psi: 14 secAsh Content: 80 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D: 85All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 16 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 55 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Preheat Temperature: 80 to 85°C Molding Temperature: 165 to 170°C Molding Pressure: 500 to 900 psi In Mold Cure Time: 100 to 200 sec Transfer Time: 6 to 15sec

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	nPDEIM_Plaskon-MUF-2B.pdf
PRICE:	Order Products email sales@su-jiao.com

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