Ablebond 84-1LMISR4

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Henkel Ablestik
Trademark: Ablebond
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: nGaEQn_Ablebond-84-1LMISR4.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
Uses
  • Adhesives
  • Electrical Parts
Appearance
  • Silver
Forms
  • Pellets
PhysicalNominal ValueUnit
Water Absorption 1(Saturation, 85°C)0.60%
pH 6.0
Weight
    Loss : 300°C 0.35%
    Loss on Cure 25.3%
Additional InformationNominal ValueUnit
Ionic Chloride < 20ppm
Ionic Potassium < 10ppm
Ionic Sodium < 10ppm
Thixotropic Index 35.60
Water Extract Conductivity 13.0µS/cm
MechanicalNominal ValueUnit
Tensile Modulus
    -65°C, 0.500 mm 4400MPa
    25°C, 0.500 mm 3900MPa
    150°C, 0.500 mm 2000MPa
    250°C, 0.500 mm 300MPa
ThermalNominal ValueUnit
Glass Transition Temperature 120°C
CLTE - Flow
    < 120°C 4.0E-5cm/cm/°C
    > 120°C 1.5E-4cm/cm/°C
Thermal Conductivity 2.5W/m/K
ElectricalNominal ValueUnitTest Method
Volume Resistivity 1.0E-4ohms·cmIEC 60093
ThermosetNominal ValueUnit
Pot Life (25°C)1100min
Shelf Life (-40°C)52wk
Thermoset Mix Viscosity 48000cP
Demold Time (175°C)60min
Note Message
1 .85%RH
2 .10 x 10 mm Si die on glass slide
3 .Viscosity @ 0.5/Viscosity @ 5 rpm
4 .Brookfield CP51 @ 5 rpm
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