Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | mk6gWn_EPO-TEK-E4110.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used. Formerly EP110 |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | 151 | ppm | |
K+ | 31 | ppm | |
Na+ | 23 | ppm | |
NH4+ | 23 | ppm | |
Particle Size | < 45.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 380 | °C | TGA |
Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
Operating Temperature | |||
Continuous | -55 to 150 | °C | |
Intermittent | -55 to 250 | °C | |
Storage Modulus (23°C) | 3.58 | GPa | |
Thixotropic Index | 2.10 | ||
Weight Loss on Heating (200°C) | 0.70 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 40.0 | °C | |
CLTE - Flow | |||
-- 2 | 4.8E-5 | cm/cm/°C | |
-- 3 | 1.5E-4 | cm/cm/°C | |
Thermal Conductivity | 1.4 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 10 | ||
Part B | Mix Ratio by Weight: 1.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | |||
-- 4 | Clear/Transparent | ||
-- 5 | Silver | ||
Density | |||
Part B | 0.948 | g/cm³ | |
Part A | 3.09 | g/cm³ | |
Viscosity 6(23°C) | 0.80 to 1.6 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 240 | min |
Cured Properties | Nominal Value | Unit | Test Method |
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Shore Hardness (Shore D) | 60 | ||
Lap Shear Strength (23°C) | 8.73 | MPa | |
Volume Resistivity | |||
23°C | < 5.0E-4 | ohms·cm | |
23°C 7 | < 7.0E-3 | ohms·cm |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part B |
5 . | Part A |
6 . | 100 rpm |
7 . | 25°C/40-60%RH/3 Day cure |
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