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EPO-TEK® T6067
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | mKltKO_EPO-TEK-T6067.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 177 | ppm | |
| K+ | 13 | ppm | |
| Na+ | 24 | ppm | |
| NH4+ | 87 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 350 | °C | |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 4.43 | GPa | |
| Weight Loss on Heating | |||
| 200°C | 0.48 | % | |
| 250°C | 0.71 | % | |
| 300°C | 1.2 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 90.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 1.6E-5 | cm/cm/°C | |
| -- 3 | 6.8E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.45 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | White | ||
| Density | 2.00 | g/cm³ | |
| Viscosity 4(23°C) | 300 to 400 | Pa·s | |
| Curing Time (150°C) | > 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 84 | ||
| Lap Shear Strength (23°C) | 10.5 | MPa | |
| Relative Permittivity (1 kHz) | 4.90 | ||
| Volume Resistivity (23°C) | > 6.0E+9 | ohms·cm | |
| Dissipation Factor (1 kHz) | 4.1E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 1 rpm |
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