Category: | PI, TS , Thermoset Polyimide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | lrBNQ9_EPO-TEK-P1011S.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Particle Size | < 20.0 | µm |
Thermoset | Nominal Value | Unit | Test Method |
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Dry Time | 7.0 | day |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 379 | °C | TGA |
Die Shear Strength - >4 kg (23°C) | 9.38 | MPa | |
Operating Temperature | |||
Continuous | -55 to 225 | °C | |
Intermittent | -55 to 325 | °C | |
Storage Modulus (23°C) | 4.41 | GPa | |
Thixotropic Index | 1.80 | ||
Weight Loss on Heating | |||
200°C | 0.080 | % | |
250°C | 0.090 | % | |
300°C | 0.16 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 100 | °C | |
CLTE - Flow | |||
-- 2 | 2.8E-5 | cm/cm/°C | |
-- 3 | 5.7E-5 | cm/cm/°C | |
Thermal Conductivity | > 2.8 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
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Shelf Life (23°C) | 52 | wk | |
Post Cure Time (285°C) | 1.5 | hr |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | Silver | ||
Density | 2.43 | g/cm³ | |
Viscosity 4(23°C) | 6.5 to 11 | Pa·s | |
Curing Time | |||
80°C 5 | < 0.50 | hr | |
150°C | 1.0 | hr |
Cured Properties | Nominal Value | Unit | Test Method |
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Shore Hardness (Shore D) | 71 | ||
Volume Resistivity (23°C) | < 5.0E-4 | ohms·cm |
Note Message | |
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1 . | Ramp 40°C/Min to 300°C |
2 . | Below Tg |
3 . | Above Tg |
4 . | 20 rpm |
5 . | Pre-Bake |
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