EPO-TEK® P1011S

Category: PI, TS , Thermoset Polyimide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: lrBNQ9_EPO-TEK-P1011S.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • High Heat Resistance
  • Thermally Conductive
  • Thixotropic
Uses
  • Adhesives
  • Electrical/Electronic Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Particle Size < 20.0µm
ThermosetNominal ValueUnitTest Method
Dry Time 7.0day
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 379°CTGA
Die Shear Strength - >4 kg (23°C) 9.38MPa
Operating Temperature
    Continuous -55 to 225°C
    Intermittent -55 to 325°C
Storage Modulus (23°C) 4.41GPa
Thixotropic Index 1.80
Weight Loss on Heating
    200°C 0.080%
    250°C 0.090%
    300°C 0.16%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 100°C
CLTE - Flow
    -- 22.8E-5cm/cm/°C
    -- 35.7E-5cm/cm/°C
Thermal Conductivity > 2.8W/m/K
ThermosetNominal ValueUnitTest Method
Shelf Life (23°C)52wk
Post Cure Time (285°C)1.5hr
Uncured PropertiesNominal ValueUnitTest Method
Color Silver
Density 2.43g/cm³
Viscosity 4(23°C)6.5 to 11Pa·s
Curing Time
    80°C 5< 0.50hr
    150°C 1.0hr
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)71
Volume Resistivity (23°C)< 5.0E-4ohms·cm
Note Message
1 .Ramp 40°C/Min to 300°C
2 .Below Tg
3 .Above Tg
4 .20 rpm
5 .Pre-Bake
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