Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | l3xVfP_EPO-TEK-E3037-LV.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
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A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. Formerly EP108-LV |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | 172 | ppm | |
K+ | 45 | ppm | |
NH4+ | 65 | ppm | |
Particle Size | < 20.0 | µm |
Additional Information | Nominal Value | Unit | |
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Degradation Temperature | 342 | °C | |
Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
Operating Temperature | |||
Continuous | -55 to 175 | °C | |
Intermittent | -55 to 275 | °C | |
Storage Modulus (23°C) | 4.30 | GPa | |
Thixotropic Index | 2.85 | ||
Weight Loss on Heating | |||
200°C | 0.16 | % | |
250°C | 0.25 | % | |
300°C | 0.32 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 90.0 | °C | |
CLTE - Flow | |||
-- 2 | 3.5E-5 | cm/cm/°C | |
-- 3 | 1.2E-4 | cm/cm/°C | |
Thermal Conductivity | 0.69 | W/m/K |
Thermoset | Nominal Value | Unit | |
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Shelf Life (-40°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
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Color | Silver | ||
Density | 2.84 | g/cm³ | |
Viscosity 4(23°C) | 9.5 to 18 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 30000 | min |
Cured Properties | Nominal Value | Unit | |
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Shore Hardness (Shore D) | 73 | ||
Lap Shear Strength (23°C) | 13.6 | MPa | |
Volume Resistivity (23°C) | < 5.0E-4 | ohms·cm |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | 10 rpm |
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