Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | kk8OCP_EPO-TEK-H20E-FC.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Particle Size | < 45.0 | µm |
Additional Information | Nominal Value | Unit | |
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Degradation Temperature | 392 | °C | |
Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
Operating Temperature | |||
Continuous | -55 to 200 | °C | |
Intermittent | -55 to 300 | °C | |
Storage Modulus | 6.39 | GPa | |
Thixotropic Index | 4.62 | ||
Weight Loss on Heating | |||
200°C | 0.73 | % | |
250°C | 1.7 | % | |
300°C | 2.4 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | 85.0 | °C | |
CLTE - Flow | |||
-- 2 | 5.3E-5 | cm/cm/°C | |
-- 3 | 2.3E-4 | cm/cm/°C | |
Thermal Conductivity | 2.6 | W/m/K |
Thermoset | Nominal Value | Unit | |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 1.0 | ||
Part B | Mix Ratio by Weight: 1.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
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Color | |||
-- 4 | Silver | ||
-- 5 | Silver | ||
Density | |||
Part B | 2.50 | g/cm³ | |
Part A | 3.79 | g/cm³ | |
Viscosity 6(23°C) | 2.4 | Pa·s | |
Curing Time (140°C) | 0.17 | hr | |
Pot Life | 1200 | min |
Cured Properties | Nominal Value | Unit | |
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Shore Hardness (Shore D) | 55 | ||
Lap Shear Strength (23°C) | > 13.8 | MPa | |
Volume Resistivity (23°C) | < 4.0E-4 | ohms·cm |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part B |
5 . | Part A |
6 . | 50 rpm |
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