APTIV® 2000

Category: PEEK , Polyetheretherketone
Manufacturer: Victrex plc
Trademark: APTIV®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: hgYK4f_APTIV-2000.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
APTIV® 2000 series films are the unfilled amorphous films made from VICTREX® PEEK™ polymer. The film provides a material solution for engineers in ultra-high performance applications.

APTIV films are a comprehensive range of versatile, high-performance films, the use of which can facilitate reduced systems costs, improved performance and enhanced design freedom.

APTIV 2000 has a unique combination of properties providing high temperature performance, light weight, mechanical strength, durability, excellent radiation, hydrolysis and chemical resistance, electrical insulation, wear and abrasion resistance, excellent barrier properties with high purity, good flammability without the use of flame retardants, low toxicity of combustion products, and low moisture absorption in a film format. Inherently halogen free and ease of processing makes APTIV films a technology enabler for our customers and end users.

Please note - APTIV 2000 will crystallize if taken above the Tg (143°C, 289°F) in either secondary processes or end use application. The crystallization is not reversible back to the amorphous phase without re-melting the material. Consideration of the temperature range during processing and end use application needs to be included if selecting APTIV 2000.
General Information
Features
  • Amorphous
  • Barrier Resin
  • Clean/High Purity
  • Durable
  • Electrically Insulating
  • Excellent Printability
  • Flame Retardant
  • Good Abrasion Resistance
  • Good Chemical Resistance
  • Good Processability
  • Good Toughness
  • Good Wear Resistance
  • Halogen Free
  • Heat Sealable
  • High Heat Resistance
  • High Strength
  • Hydrolysis Resistant
  • Low Moisture Absorption
  • Low Smoke Emission
  • Low Toxicity
  • Metallizable
  • Radiation (Gamma) Resistant
  • Recyclable Material
  • Weldable
Uses
  • Aerospace Applications
  • Compounding
  • Diaphragms
  • Electrical Parts
  • Film
  • Insulation
  • Laminates
  • Printed Circuit Boards
Agency Ratings
  • EU 2002/72/EC
  • EU 2004/19/EC
  • FDA 21 CFR 177.2415
RoHS Compliance
  • RoHS Compliant
Forms
  • Film
Processing Method
  • Coating
  • Laminating
  • Thermoforming
PhysicalNominal ValueUnitTest Method
Density (23°C)1.26g/cm³ISO 1183
Water Absorption 1(Equilibrium, 23°C, 0.0500 mm, 50% RH)0.21%ISO 62
Shrinkage 2
    MD : 200°C, 50.0 µm < 10%
    TD : 200°C, 50.0 µm < 5.0%
ElectricalNominal ValueUnitTest Method
Dielectric Breakdown ASTM D149
    23°C, 25.0 µm 6750V
    23°C, 50.0 µm 9500V
    23°C, 125.0 µm 15000V
Additional InformationNominal ValueUnitTest Method
Puncture Resistance (23°C, 50.0 µm) 40.0kJ/m²Internal Method
FilmsNominal ValueUnitTest Method
Film Thickness - Recommended / Available 6 to 300 µm
Tensile Modulus ISO 527-3
    MD : 23°C, 25 µm 1800MPa
    TD : 23°C, 25 µm 1800MPa
    MD : 23°C, 50 µm 1800MPa
    TD : 23°C, 50 µm 1800MPa
    MD : 23°C, 100 µm 1600MPa
    TD : 23°C, 100 µm 1600MPa
Tensile Stress ISO 527-3
    MD : Break, 23°C, 25 µm 130MPa
    TD : Break, 23°C, 25 µm 130MPa
    MD : Break, 23°C, 50 µm 120MPa
    TD : Break, 23°C, 50 µm 120MPa
    MD : Break, 23°C, 100 µm 120MPa
    TD : Break, 23°C, 100 µm 120MPa
Tensile Elongation ISO 527-3
    MD : Break, 23°C, 25 µm > 200%
    TD : Break, 23°C, 25 µm > 200%
    MD : Break, 23°C, 50 µm > 200%
    TD : Break, 23°C, 50 µm > 200%
    MD : Break, 23°C, 100 µm > 200%
    TD : Break, 23°C, 100 µm > 200%
Trouser Tear Resistance 3ISO 6383-1
    MD : 50 µm 6.00N/mm
    TD : 50 µm 6.00N/mm
ThermalNominal ValueUnitTest Method
Peak Crystallization Temperature (DSC) 143°C
CLTE - Flow 4(0.0500 mm)6.0E-5cm/cm/°CASTM D696
ElectricalNominal ValueUnitTest Method
Volume Resistivity 5(23°C, 0.0500 mm)2.0E+16ohms·cmASTM D257
Dielectric Strength ASTM D149
    23°C, 0.0250 mm 270kV/mm
    23°C, 0.0500 mm 6190kV/mm
    23°C, 0.100 mm 120kV/mm
Dielectric Constant (23°C, 0.0500 mm, 10 MHz)3.30ASTM D150
Dissipation Factor (23°C, 0.0500 mm, 10 MHz)3.0E-3ASTM D150
Note Message
1 .24 hrs
2 .TM-VX-84
3 .23°C
4 .below Tg
5 .100 V
6 .6.35 mm electrode
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