Category: | PEEK , Polyetheretherketone |
Manufacturer: | Victrex plc |
Trademark: | APTIV® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | hgYK4f_APTIV-2000.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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APTIV® 2000 series films are the unfilled amorphous films made from VICTREX® PEEK™ polymer. The film provides a material solution for engineers in ultra-high performance applications. APTIV films are a comprehensive range of versatile, high-performance films, the use of which can facilitate reduced systems costs, improved performance and enhanced design freedom. APTIV 2000 has a unique combination of properties providing high temperature performance, light weight, mechanical strength, durability, excellent radiation, hydrolysis and chemical resistance, electrical insulation, wear and abrasion resistance, excellent barrier properties with high purity, good flammability without the use of flame retardants, low toxicity of combustion products, and low moisture absorption in a film format. Inherently halogen free and ease of processing makes APTIV films a technology enabler for our customers and end users. Please note - APTIV 2000 will crystallize if taken above the Tg (143°C, 289°F) in either secondary processes or end use application. The crystallization is not reversible back to the amorphous phase without re-melting the material. Consideration of the temperature range during processing and end use application needs to be included if selecting APTIV 2000. |
General Information | |
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Features |
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Agency Ratings |
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RoHS Compliance |
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Processing Method |
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Physical | Nominal Value | Unit | Test Method |
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Density (23°C) | 1.26 | g/cm³ | ISO 1183 |
Water Absorption 1(Equilibrium, 23°C, 0.0500 mm, 50% RH) | 0.21 | % | ISO 62 |
Shrinkage 2 | |||
MD : 200°C, 50.0 µm | < 10 | % | |
TD : 200°C, 50.0 µm | < 5.0 | % |
Electrical | Nominal Value | Unit | Test Method |
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Dielectric Breakdown | ASTM D149 | ||
23°C, 25.0 µm | 6750 | V | |
23°C, 50.0 µm | 9500 | V | |
23°C, 125.0 µm | 15000 | V |
Additional Information | Nominal Value | Unit | Test Method |
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Puncture Resistance (23°C, 50.0 µm) | 40.0 | kJ/m² | Internal Method |
Films | Nominal Value | Unit | Test Method |
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Film Thickness - Recommended / Available | 6 to 300 µm | ||
Tensile Modulus | ISO 527-3 | ||
MD : 23°C, 25 µm | 1800 | MPa | |
TD : 23°C, 25 µm | 1800 | MPa | |
MD : 23°C, 50 µm | 1800 | MPa | |
TD : 23°C, 50 µm | 1800 | MPa | |
MD : 23°C, 100 µm | 1600 | MPa | |
TD : 23°C, 100 µm | 1600 | MPa | |
Tensile Stress | ISO 527-3 | ||
MD : Break, 23°C, 25 µm | 130 | MPa | |
TD : Break, 23°C, 25 µm | 130 | MPa | |
MD : Break, 23°C, 50 µm | 120 | MPa | |
TD : Break, 23°C, 50 µm | 120 | MPa | |
MD : Break, 23°C, 100 µm | 120 | MPa | |
TD : Break, 23°C, 100 µm | 120 | MPa | |
Tensile Elongation | ISO 527-3 | ||
MD : Break, 23°C, 25 µm | > 200 | % | |
TD : Break, 23°C, 25 µm | > 200 | % | |
MD : Break, 23°C, 50 µm | > 200 | % | |
TD : Break, 23°C, 50 µm | > 200 | % | |
MD : Break, 23°C, 100 µm | > 200 | % | |
TD : Break, 23°C, 100 µm | > 200 | % | |
Trouser Tear Resistance 3 | ISO 6383-1 | ||
MD : 50 µm | 6.00 | N/mm | |
TD : 50 µm | 6.00 | N/mm |
Thermal | Nominal Value | Unit | Test Method |
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Peak Crystallization Temperature (DSC) | 143 | °C | |
CLTE - Flow 4(0.0500 mm) | 6.0E-5 | cm/cm/°C | ASTM D696 |
Electrical | Nominal Value | Unit | Test Method |
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Volume Resistivity 5(23°C, 0.0500 mm) | 2.0E+16 | ohms·cm | ASTM D257 |
Dielectric Strength | ASTM D149 | ||
23°C, 0.0250 mm | 270 | kV/mm | |
23°C, 0.0500 mm 6 | 190 | kV/mm | |
23°C, 0.100 mm | 120 | kV/mm | |
Dielectric Constant (23°C, 0.0500 mm, 10 MHz) | 3.30 | ASTM D150 | |
Dissipation Factor (23°C, 0.0500 mm, 10 MHz) | 3.0E-3 | ASTM D150 |
Note Message | |
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1 . | 24 hrs |
2 . | TM-VX-84 |
3 . | 23°C |
4 . | below Tg |
5 . | 100 V |
6 . | 6.35 mm electrode |
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