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NEMCON H PC DP164
| Category: | PC , Polycarbonate |
| Manufacturer: | Ovation Polymers Inc. |
| Trademark: | NEMCON H |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | hAhEi2_NEMCON-H-PC-DP164.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| PC based, thermally conducting, electrically insulating grade with improved processability. |
| General Information | |
|---|---|
| Features |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.35 | g/cm³ | ASTM D792 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus 1(23°C) | 3950 | MPa | ASTM D638 |
| Tensile Strength 2(Break, 23°C) | 27.0 | MPa | ASTM D638 |
| Tensile Elongation 3(Break, 23°C) | 1.2 | % | ASTM D638 |
| Flexural Modulus 4(23°C, 50.0 mm Span) | 3690 | MPa | ASTM D790 |
| Flexural Strength 5(Break, 23°C, 50.0 mm Span) | 38.0 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C) | 130 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermal Conductivity | Internal Method | ||
| 23°C 6 | 1.3 to 1.5 | W/m/K | |
| 23°C 7 | 5.5 to 8.0 | W/m/K |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 100 | °C | |
| Drying Time | 4.0 | hr | |
| Suggested Max Moisture | 0.050 | % | |
| Rear Temperature | 250 to 260 | °C | |
| Middle Temperature | 260 to 270 | °C | |
| Front Temperature | 260 to 280 | °C | |
| Nozzle Temperature | 270 to 290 | °C | |
| Processing (Melt) Temp | 270 to 290 | °C | |
| Mold Temperature | 110 to 130 | °C | |
| Back Pressure | 0.414 to 0.689 | MPa | |
| Screw Speed | 60 to 120 | rpm |
| Note Message | |
|---|---|
| 1 . | 50 mm/min |
| 2 . | 50 mm/min |
| 3 . | 50 mm/min |
| 4 . | 1.3 mm/min |
| 5 . | 1.3 mm/min |
| 6 . | Through Plane |
| 7 . | In Plane |
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