Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | BCC Products Inc. |
Trademark: | BCC Resins |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | gtsBF5_BCC-Resins-HPX-850.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
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HPX-850 is a light weight, heat resistant, two component epoxy backfill system. Like BC 7020, the filler portion is pre-blended into the resin and hardener components for easier handling, thus simplifying the mixing process. HPX-850 features advantages such as low cost, long pot life, machineability, and low shrinkage. It is ideally suited for numerous applications involving mold and core constructions. HPX-850 can be removed from the mold after allowing to set 24 hours @ room temperature (75°F). Post cure for applications requiring temperatures above 150°F can be accomplished in an oven or in use by a gradual heat rise; 2 hours @ 150°F, plus 2 hours @ 250°F, plus 2 hours at 300°F. |
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Physical | Nominal Value | Unit | Test Method |
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Specific Gravity | |||
-- | 0.818 | g/cm³ | ASTM D792 |
-- | 0.830 | g/cm³ | ASTM D1505 |
Molding Shrinkage - Flow | 0.020 | % | ASTM D955 |
Thermal | Nominal Value | Unit | Test Method |
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Deflection Temperature Under Load (1.8 MPa, Unannealed) | 141 | °C | ASTM D648 |
Thermoset | Nominal Value | Unit | |
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Thermoset Components | |||
Hardener | Mix Ratio by Weight: 1.0 | ||
Resin | Mix Ratio by Weight: 6.0 | ||
Pot Life (24°C) | 120 to 150 | min | |
Demold Time | 1400 | min |
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