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EPO-TEK® E2001
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | godKQG_EPO-TEK-E2001.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 45.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 428 | °C | TGA |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 2.59 | GPa | |
| Thixotropic Index | 2.70 | ||
| Weight Loss on Heating | |||
| 200°C | 0.040 | % | |
| 300°C | 0.22 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 90.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 5.0E-5 | cm/cm/°C | |
| -- 3 | 1.2E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.93 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 3.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Silver | ||
| Density | |||
| Part B | 1.04 | g/cm³ | |
| Part A | 2.77 | g/cm³ | |
| Viscosity 6(23°C) | 2.0 to 4.1 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 1400 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 78 | ||
| Lap Shear Strength (23°C) | 9.59 | MPa | |
| Volume Resistivity | |||
| 23°C | < 5.0E-4 | ohms·cm | |
| 23°C 7 | 7.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 100 rpm |
| 7 . | 200°C/2 min cure |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| NEOFLON™ EP-526 | Daikin Fluorochemicals (China) Co., Ltd. | ETFE | NEOFLON™ |
| Nucrel® 30705 | DuPont Packaging & Industrial Polymers | EAA | Nucrel® |
| Hifax CA 1133 A | LyondellBasell Industries | TPO (POE) | Hifax |
| INTENE® 40 AF | Versalis S.p.A. | PBR, Low Cis | INTENE® |
| Polychim HS15XC | Polychim Industrie S.A.S. | PP Homopolymer | Polychim |
