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SKYBOND® 705

Category:	API , Aromatic Polyimide
Manufacturer:	Industrial Summit Technology Co.
Trademark:	SKYBOND®
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	gQIiut_SKYBOND-705.pdf
PRICE:	Order Products email sales@su-jiao.com

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Message
The Skybond® product line encompasses a number of products usable as matrix resins for manufacture of high thermal stability structural composites. Composites based on the Skybond® family of resins have continuous use temperatures in excess of 600° F with short term capability greater than 1000° F. Prepreg has been successfully manufactured from all common high performance substrates, such as, E-glass, high modulus carbon, and quartz. Two new classes of matrix resins have been developed in the Skybond® family. The first can be processed by RTM molding techniques to bring the outstanding thermal resistance of polyimide resins to RTM molded composites. The second new class of Skybond® matrix resins is the two-stage cure resins that when used in prepreg applications allow the manufacture of very low void level composites by autoclave processing (<0.5% voids) combined with excellent thermal stability of polyimide resins.

Message

The Skybond® product line encompasses a number of products usable as matrix resins for manufacture of high thermal stability structural composites. Composites based on the Skybond® family of resins have continuous use temperatures in excess of 600° F with short term capability greater than 1000° F. Prepreg has been successfully manufactured from all common high performance substrates, such as, E-glass, high modulus carbon, and quartz. Two new classes of matrix resins have been developed in the Skybond® family. The first can be processed by RTM molding techniques to bring the outstanding thermal resistance of polyimide resins to RTM molded composites. The second new class of Skybond® matrix resins is the two-stage cure resins that when used in prepreg applications allow the manufacture of very low void level composites by autoclave processing (<0.5% voids) combined with excellent thermal stability of polyimide resins.

General Information
Features	Good Thermal Stability
Uses	Compounding

Physical	Nominal Value	Unit
Density	1.05 to 1.08	g/cm³
Solution Viscosity	1100 to 2600	mPa·s
Solids Content	16 to 20	%

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