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EPO-TEK® H20E-LC
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | fg2Xxd_EPO-TEK-H20E-LC.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is the conductive adhesive of choice for low chloride applications. |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 11 | ppm | |
| K+ | 2 | ppm | |
| Na+ | 6 | ppm | |
| NH4+ | 259 | ppm | |
| Particle Size | < 45.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 451 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus | 6.48 | GPa | |
| Thixotropic Index | 4.60 | ||
| Weight Loss on Heating | |||
| 200°C | 0.42 | % | |
| 250°C | 1.0 | % | |
| 300°C | 2.0 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 80.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.4E-5 | cm/cm/°C | |
| -- 3 | 1.7E-4 | cm/cm/°C | |
| Thermal Conductivity | 2.0 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Silver | ||
| -- 5 | Silver | ||
| Density | |||
| Part A | 2.41 | g/cm³ | |
| Part B | 3.06 | g/cm³ | |
| Viscosity 6(23°C) | 2.2 to 3.2 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 5800 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 60 | ||
| Lap Shear Strength (23°C) | 11.5 | MPa | |
| Volume Resistivity (23°C) | < 4.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 100 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Sumitomo Phenolic FM 4005X4649 | Sumitomo Bakelite North America, Inc. | Phenolic | Sumitomo Phenolic |
| NEOPLAST 240 FT EB | Zylog Plastalloys | TPV | NEOPLAST |
| Devcon DFense Blok™ | Devcon | Epoxy | Devcon |
| InnoPlus LL9630A | PTT Global Chemical Public Company Limited | LLDPE | InnoPlus |
| Honghai CPE 130A | Weifang Honghai Plastics Technology Co., Ltd. | CPE | Honghai |
