Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | fbAh0f_EPO-TEK-T7110.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics. |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Processing Method |
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Physical | Nominal Value | Unit | |
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Particle Size | < 50.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 314 | °C | TGA |
Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
Operating Temperature | |||
Continuous | -55 to 150 | °C | |
Intermittent | -55 to 250 | °C | |
Storage Modulus (23°C) | 5.44 | GPa | |
Thixotropic Index | 2.20 | ||
Weight Loss on Heating | |||
200°C | 0.40 | % | |
250°C | 0.66 | % | |
300°C | 1.8 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 40.0 | °C | |
CLTE - Flow | |||
-- 2 | 3.1E-5 | cm/cm/°C | |
-- 3 | 1.4E-4 | cm/cm/°C | |
Thermal Conductivity | 1.0 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 10 | ||
Part B | Mix Ratio by Weight: 1.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | |||
-- 4 | Clear/Transparent | ||
-- 5 | Grey | ||
Density | |||
Part B | 0.918 | g/cm³ | |
Part A | 2.27 | g/cm³ | |
Viscosity 6(23°C) | 1.4 to 2.2 | Pa·s | |
Curing Time (80°C) | > 2.0 | hr | |
Pot Life | 210 | min |
Cured Properties | Nominal Value | Unit | Test Method |
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Shore Hardness (Shore D) | 91 | ||
Lap Shear Strength (23°C) | > 13.3 | MPa | |
Relative Permittivity (1 kHz) | 5.69 | ||
Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
Dissipation Factor (1 kHz) | 9.0E-3 |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part B |
5 . | Part A |
6 . | 100 rpm |
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