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EPO-TEK® H20E-HC
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | fPSwpf_EPO-TEK-H20E-HC.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. Also available in a single component frozen syringe. This is an increased thermal conductivity version of EPO-TEK H20E. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 34 | ppm | |
| K+ | 17 | ppm | |
| Na+ | 24 | ppm | |
| NH4+ | 45 | ppm | |
| Particle Size | < 45.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 372 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 175 | °C | |
| Intermittent | -55 to 275 | °C | |
| Storage Modulus | 3.95 | GPa | |
| Thixotropic Index | 3.48 | ||
| Weight Loss on Heating | |||
| 200°C | 0.14 | % | |
| 250°C | 0.42 | % | |
| 300°C | 1.1 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| CLTE - Flow | |||
| -- 1 | 5.3E-5 | cm/cm/°C | |
| -- 2 | 8.0E-5 | cm/cm/°C | |
| Thermal Conductivity | |||
| -- 3 | 11 | W/m/K | |
| -- 4 | 23 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 5 | Silver | ||
| -- 6 | Silver | ||
| Density | |||
| Part A | 3.43 | g/cm³ | |
| Part B | 4.38 | g/cm³ | |
| Viscosity 7(23°C) | 3.5 to 6.0 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 3600 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 93 | ||
| Volume Resistivity (23°C) | < 8.0E-5 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Below Tg |
| 2 . | Above Tg |
| 3 . | 150°C/1 Hour Cure |
| 4 . | 150°C/1 Hour+200°C/1 Hour Cure |
| 5 . | Part B |
| 6 . | Part A |
| 7 . | 50 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 1501-55D | RTP Company | TEEE | RTP |
| Milastomer™ 5530NS | Mitsui Chemicals America, Inc. | TPV | Milastomer™ |
| THERMALGRAPH® DKD | Cytec Industries Inc. | Carbon/Epoxy | THERMALGRAPH® |
| FHR Polypropylene P4C6B-194 | Flint Hills Resources, LP | PP Homopolymer | FHR Polypropylene |
| LubriOne™ NN-000/10T | PolyOne Corporation | Nylon 66 | LubriOne™ |
