| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxies, Etc. |
| Trademark: | Epoxies, Ect. |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | f6Kv36_Epoxies-Ect-20-3035-Cat-30-.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds. 20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance. Features:
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| General Information | |
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| Features |
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| Uses |
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| Processing Method |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Molding Shrinkage - Flow | 0.20 | % |
| Mechanical | Nominal Value | Unit | |
|---|---|---|---|
| Flexural Strength | 46.9 | MPa |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| CLTE - Flow | 4.0E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.19 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Mix Viscosity (25°C) | 15000 | cP |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Operating Temperature | -55.0 to 155 | °C | |
| Outgassing | |||
| % CVCM | 0.0600 | ||
| % TMLV | 0.490 |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Mix Ratio by Weight (PBW) | |||
| Part A | 100 | ||
| Part B | 21 | ||
| Density (25°C) | 0.828 | g/cm³ | |
| Viscosity 1(25°C) | 45 | Pa·s | |
| Curing Time | |||
| 100°C | 2.0 to 3.0 | hr | |
| 85°C | 3.0 to 4.0 | hr | |
| Pot Life 2(25°C) | 240 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Water Absorption 3 | 0.050 | % | |
| Shore Hardness (Shore D) | 82 | ||
| Tensile Strength | 33.1 | MPa | |
| Compression Strength | 82.7 | MPa | |
| Electric Strength | 15 | kV/mm | |
| Relative Permittivity (1 MHz) | 2.73 | ||
| Volume Resistivity (25°C) | > 1.0E+13 | ohms·cm | |
| Dissipation Factor (1 MHz) | 0.050 |
| Note Message | |
|---|---|
| 1 . | Part A |
| 2 . | 100 grams |
| 3 . | After 24 hours |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| SLOVALEN® PC 93 T 30 | Plastcom | PP, Unspecified | SLOVALEN® |
| Xuchuan XCY-5512 | Xuchuan Chemical (Suzhou) Co., Ltd | PUR, Unspecified | Xuchuan |
| Andur 8 APLF/Curene® 442 | Anderson Development Company | PUR-Ester/TDI | Andur |
| Chemical Resources PC2200 | Chemical Resources, Inc. | PC | Chemical Resources |
| LNP™ STAT-KON™ EEF42 compound | SABIC Innovative Plastics | PEI | LNP™ STAT-KON™ |