Fortron® 4665B6

Category: PPS , Polyphenylene Sulfide
Manufacturer: Celanese Corporation
Trademark: Fortron®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: ecN7Zc_Fortron-4665B6.pdf
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Message
Fortron 4665B6 offers a high Comparative Tracking Index (CTI) for application requiring resistance to high voltage. The product exhibits good heat and chemical resistance as well as good electrical properties. This grade is also inherently flame-retardant. Due to the balance of mineral and glass fibers the warpage is very low. Applications include electronic components (i.e. lamp sockets, housings and position frames).
General Information
Filler / Reinforcement
  • Glass \mineral, 65% filler by weight
Features
  • Low warpage
  • Good electrical performance
  • Good chemical resistance
  • Heat resistance, high
  • Flame retardancy
Uses
  • Electrical/Electronic Applications
  • Shell
RoHS Compliance
  • Contact manufacturer
PhysicalNominal ValueUnitTest Method
Density 2.03g/cm³ISO 1183
Molding Shrinkage ISO 294-4
    Vertical flow direction 0.30 - 0.70%ISO 294-4
    Flow direction 0.20 - 0.60%ISO 294-4
Water Absorption (Saturation, 23°C)0.020%ISO 62
HardnessNominal ValueUnitTest Method
Rockwell Hardness (M-Scale)100ISO 2039-2
MechanicalNominal ValueUnitTest Method
Tensile Modulus 17300MPaISO 527-2/1A/1
Tensile Stress (Break)110MPaISO 527-2/1A/5
Tensile Strain (Break)1.2%ISO 527-2/1A/5
Flexural Modulus (23°C)16000MPaISO 178
Flexural Stress 1180MPaISO 178
ImpactNominal ValueUnitTest Method
Charpy Notched Impact Strength ISO 179/1eA
    -30°C 6.0kJ/m²ISO 179/1eA
    23°C 6.0kJ/m²ISO 179/1eA
Charpy Unnotched Impact Strength ISO 179/1eU
    -30°C 18kJ/m²ISO 179/1eU
    23°C 18kJ/m²ISO 179/1eU
Notched Izod Impact ISO 180/1A
    -30°C 5.0kJ/m²ISO 180/1A
    23°C 5.0kJ/m²ISO 180/1A
ThermalNominal ValueUnitTest Method
Heat Deflection Temperature
    1.8 MPa, not annealed 270°CISO 75-2/A
    8.0 MPa, not annealed 215°CISO 75-2/C
Glass Transition Temperature 290.0°CISO 11357-2
Melting Temperature 3280°CISO 11357-3
Linear thermal expansion coefficient ISO 11359-2
    Flow 2.0E-5cm/cm/°CISO 11359-2
    Lateral 2.5E-5cm/cm/°CISO 11359-2
ElectricalNominal ValueUnitTest Method
Surface Resistivity > 1.0E+15ohmsIEC 60093
Volume Resistivity > 1.0E+15ohms·cmIEC 60093
Dielectric Strength 25kV/mmIEC 60243-1
Relative Permittivity (1 MHz)5.30IEC 60250
Dissipation Factor (1 MHz)2.0E-3IEC 60250
Comparative Tracking Index 250VIEC 60112
FlammabilityNominal ValueUnitTest Method
Flame Rating UL 94
    0.820 mm V-0UL 94
    1.50 mm V-0UL 94
InjectionNominal ValueUnit
Drying Temperature 130 - 140°C
Drying Time 3.0 - 4.0hr
Suggested Max Moisture 0.020%
Hopper Temperature 20.0 - 30.0°C
Rear Temperature 290 - 300°C
Middle Temperature 310 - 320°C
Front Temperature 330 - 340°C
Nozzle Temperature 310 - 330°C
Processing (Melt) Temp 330 - 340°C
Mold Temperature 140 - 160°C
Injection Pressure 50.0 - 100MPa
Injection Rate Fast
Holding Pressure 30.0 - 70.0MPa
Back Pressure 0.00 - 3.00MPa
Injection instructions
Manifold Temperature: 330 to 340°CZone 4 Temperature: 330 to 340°CFeed Temperature: 60 to 80°C
Note Message
1 .Break
2 .10°C/min
3 .10°C/min
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