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EPO-TEK® H74F
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | dsLSi8_EPO-TEK-H74F.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip underfill, sealing sensor devices packaged in TO-cans or fiber optic feed-through. It may be considered a finer particle version of EPO-TEK® H74. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 41 | ppm | |
| K+ | 9 | ppm | |
| Na+ | 20 | ppm | |
| NH4+ | 100 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 486 | °C | |
| Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 4.40 | GPa | |
| Thixotropic Index | 1.90 | ||
| Weight Loss on Heating | |||
| 200°C | 0.050 | % | |
| 250°C | 0.050 | % | |
| 300°C | 0.10 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 90.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.3E-5 | cm/cm/°C | |
| -- 3 | 1.1E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.52 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 4.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Grey | ||
| Density | |||
| Part B | 1.02 | g/cm³ | |
| Part A | 2.01 | g/cm³ | |
| Viscosity 6(23°C) | 45 to 75 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 180 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 88 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 4.90 | ||
| Volume Resistivity (23°C) | > 5.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.012 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 5 rpm |
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