FM® 209-1 is a next generation film adhesive specially formulated for out-of-autoclave bonding of both metallic and composite structures. This new adhesive provides similar performance in vacuum-only versus autoclave cure and has a unique combination of toughness and shear strength up to 121°C (250°F). FM 209-1 is designed for bonding metallic and composite substrates in monolithic and sandwich structures. It is compatible with most 121°C (250°F) and 177°C (350°F) curing epoxy-based prepreg systems for co-cure, co-bond and secondary bonding. FM 209-1 adhesive film provides minimum shop life of 30 days at 24°C (75°F). FM 209-1 adhesive has excellent resistance to both pre-bond and post- bond humidity exposures. FM 209-1 adhesive is supplied at various weights and thicknesses as an unsupported film or as a supported film with woven, knit or mat carrier. FM 209-1 film adhesive can be cured within the temperature range of 71°C to 177°C (160°F to 350°F) under vacuum-only pressure. The standard cure cycle for FM 209-1 is 121°C (250°F) for 90 minutes under full vacuum for out-of-autoclave (OOA) bonding applications or under 0.28 MPa (40 psi) pressure for autoclave cures.
Suggested Applications:
Out-of-autoclave bonding of metal and composite monolithic and sandwich structures
Applications requiring low temperature cure
Applications requiring good serviceability at low temperature
|
