Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | dDbmEq_EPO-TEK-H77-Black.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® H77 Black is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic. |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Processing Method |
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Physical | Nominal Value | Unit | |
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Particle Size | < 50.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 405 | °C | TGA |
Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
Operating Temperature | |||
Continuous | -55 to 250 | °C | |
Intermittent | -55 to 350 | °C | |
Storage Modulus (23°C) | 6.24 | GPa | |
Thixotropic Index | 1.72 | ||
Weight Loss on Heating | |||
200°C | 0.15 | % | |
250°C | 0.38 | % | |
300°C | 1.5 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 75.0 | °C | |
CLTE - Flow | |||
-- 2 | 3.8E-5 | cm/cm/°C | |
-- 3 | 1.6E-4 | cm/cm/°C | |
Thermal Conductivity | 0.66 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 100 | ||
Part B | Mix Ratio by Weight: 15 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | |||
-- 4 | Amber | ||
-- 5 | Black | ||
Density | |||
Part B | 1.22 | g/cm³ | |
Part A | 2.52 | g/cm³ | |
Viscosity 6(23°C) | 6.0 to 12 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 360 | min |
Cured Properties | Nominal Value | Unit | Test Method |
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Shore Hardness (Shore D) | 90 | ||
Lap Shear Strength (23°C) | 10.5 | MPa | |
Relative Permittivity (1 kHz) | 5.91 | ||
Volume Resistivity (23°C) | > 2.8E+13 | ohms·cm | |
Dissipation Factor (1 kHz) | 8.0E-3 |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -40-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part B |
5 . | Part A |
6 . | 20 rpm |
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