KumhoSunny PC HCG2530MP

Category: PC , Polycarbonate
Manufacturer: Shanghai KumhoSunny Plastics Co., Ltd.
Trademark: KumhoSunny PC
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: bpPliG_KumhoSunny-PC-HCG2530MP.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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HCG2530MP is high rigidity and balance tenacity 30%GF PC resin. It has excellent surface, high NCVM rate, easy to machining, high stability and super shape resistance property. HCG2530MP is mainly used in mobile phone
General Information
Filler / Reinforcement
  • Glass Fiber, 30% Filler by Weight
Features
  • Good Stability
  • Good Surface Finish
  • High Rigidity
  • Machinable
Uses
  • Cell Phones
UL File Number
  • E254819
Forms
  • Pellets
Processing Method
  • Injection Molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.43g/cm³ASTM D792
Melt Mass-Flow Rate (MFR) (300°C/1.2 kg)16g/10 minASTM D1238
Molding Shrinkage - Flow 0.10 to 0.30%ASTM D955
MechanicalNominal ValueUnitTest Method
Tensile Strength 120MPaASTM D638
Tensile Elongation (Break)1.5%ASTM D638
Flexural Modulus 7500MPaASTM D790
Flexural Strength 180MPaASTM D790
ImpactNominal ValueUnitTest Method
Notched Izod Impact (3.20 mm)120J/mASTM D256
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed)138°CASTM D648
ElectricalNominal ValueUnitTest Method
Surface Resistivity > 1.0E+15ohmsIEC 60093
Volume Resistivity > 1.0E+15ohms·cmIEC 60093
FlammabilityNominal ValueUnitTest Method
Flame Rating (1.60 mm)HBUL 94
InjectionNominal ValueUnit
Drying Temperature 100 to 120°C
Drying Time 3.0 to 4.0hr
Suggested Max Moisture 0.020%
Rear Temperature 250 to 270°C
Middle Temperature 260 to 280°C
Front Temperature 280 to 300°C
Nozzle Temperature 280 to 290°C
Processing (Melt) Temp 290 to 300°C
Mold Temperature 100 to 140°C
Back Pressure 0.300 to 1.00MPa
Screw Speed 20 to 100rpm
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