Miramid® SE30C

Category: Nylon 66 , Polyamide 66
Manufacturer: BASF Leuna GmbH
Trademark: Miramid®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: bi2yGg_Miramid-SE30C.pdf
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Message
Miramid® SE30C is a Polyamide 66 (Nylon 66) material filled with 30% glass fiber. It is available in Europe for injection molding.

Important attributes of Miramid® SE30C are:
  • Chemical Resistant
  • Crystalline
  • Fast Molding Cycle
  • Good Dimensional Stability
  • Good Stiffness

Typical applications include:
  • Automotive
  • Electrical/Electronic Applications
General Information
Filler / Reinforcement
  • Glass Fiber, 30% Filler by Weight
Additive
  • Mold Release
Features
  • Crystalline
  • Fast Molding Cycle
  • Fuel Resistant
  • Good Dimensional Stability
  • Good Flow
  • Good Stiffness
  • Grease Resistant
  • High Rigidity
  • Oil Resistant
  • Solvent Resistant
Uses
  • Automotive Applications
  • Electrical Parts
Forms
  • Granules
Processing Method
  • Injection Molding
Multi-Point Data
  • Isothermal Stress vs. Strain (ISO 11403-1)
  • Secant Modulus vs. Strain (ISO 11403-1)
PhysicalDryConditionedUnitTest Method
Density 1360--kg/m³ISO 1183 1
Water Absorption ISO 62 2
     Saturation 5.3--%
     Equilibrium 1.6--%
Viscosity number 145--cm³/gISO 307, 1157, 1628 3
MechanicalDryConditionedUnitTest Method
Tensile modulus 100007000MPaISO 527-2 4
Tensile Stress (Break)185140MPaISO 527-2 5
Tensile Strain (Break)3.05.0%ISO 527-2 6
Flexural Stress 7270200MPaISO 178
ImpactDryConditionedUnitTest Method
Charpy notched impact strength ISO 179/1eA 8
     -30°C 9.00--kJ/m²
     23°C 10.012.0kJ/m²
Charpy impact strength ISO 179/1eU 9
     -30°C 45.0--kJ/m²
     23°C 80.090.0kJ/m²
ThermalDryConditionedUnitTest Method
Deflection Temperature Under Load ISO 75-2 10
     0.45 MPa 250--°C
     1.8 MPa 250--°C
Melting Temperature (DSC) 260--°CISO 3146
ElectricalDryConditionedUnitTest Method
Volume resistivity 1.0E+131.0E+10ohms·mIEC 60093 11
Dielectric Constant (1 MHz)3.505.50IEC 60250
Dissipation Factor (1 MHz)0.0150.30IEC 60250 12
Comparative tracking index 550--IEC 60112 13
InjectionDryUnit
Processing (Melt) Temp 280 to 300°C
Mold Temperature 80.0 to 100°C
Note Message
1 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
2 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
3 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
4 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
5 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
6 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
7 .Typical values for uncoloured product at 23°C
8 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
9 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
10 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
11 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
12 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
13 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
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