DOW™ Electrical & Telecommunications HFDK-0586 BK

Category: Ethylene Copolymer , Crosslinkable Semiconductive Shielding Compound
Manufacturer: The Dow Chemical Company
Trademark: DOW™ Electrical & Telecommunications
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: bNHYKU_DOW-Electrical-Telecommunications-HFDK-0586-BK.pdf
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Message
HFDK-0586 BK is a crosslinkable semiconductive compound based on an ethylene copolymer and is designed for conductor shield and bonded insulation shield for use in medium and high voltage cables. HFDK-0586 BK has an excellent compatibility with both copper and aluminium. It has an excellent conductivity, excellent mechanical properties, also after ageing. The smoothness and the extrudability (also in triple extruders) are very good.

Specifications:
Cables with conductor or insulation shielding of HFDK-0586 BK, prepared using sound commercial fabrication practice, should meet the latest edition of the following industry cable specifications:
  • AIEC: CS 8-00 and CS 7-93
  • BS: 6622
  • DIN: VDE 0263 and 0276
  • IEC: 60502 and 60840
  • ICEA: S 95 658 and S 66 524 (NEMA WC7-1966)
  • NF: C 33-223
  • HD: 620 S1
General Information
Uses
  • Semiconductive Shield
  • Underground cable
  • Cable guard
  • Wire and cable applications
Agency Ratings
  • AEIC CS7-93
  • AEIC CS8-00
  • BS 6622
  • HD 620 S1
  • ICEA S-66-524
  • ICEA S-95-658
  • IEC 60502
  • IEC 60840
  • NEMA WC-7
  • NF C 33-223
  • VDE 0263
Forms
  • Particle
PhysicalNominal ValueUnitTest Method
Density 1.12g/cm³ISO 1183/D
Moisture Content - Karl Fischer ppmInternal method
ThermalNominal ValueUnitTest Method
Thermoset 1IEC 60811-2-1
    Elongation with load : 200°C 50%IEC 60811-2-1
    Elongation without load : 200°C 0.0%IEC 60811-2-1
Additional InformationNominal ValueUnitTest Method
Moving Die Rheometer ASTM D5287
    Crosslinking Time, T90 : 182°C 5.4minASTM D5287
    Maximum Torque, MH : 182°C 11.2dNmASTM D5287
    Scorch Time TS1 : 140°C 31.0minASTM D5287
MechanicalNominal ValueUnitTest Method
Tensile Strength 220.0MPaIEC 60811-1-1
Tensile Elongation 3(Break)> 200%IEC 60811-1-1
AgingNominal ValueUnitTest Method
Change in Tensile Strength 4(150°C, 240 hr)< 25%IEC 60811-1-2
Change in Ultimate Elongation 5(150°C, 240 hr)< 25%IEC 60811-1-2
ElectricalNominal ValueUnitTest Method
Volume Resistivity 6IEC 60093
    23°C 40ohms·cmIEC 60093
    90°C < 1.0E+2ohms·cmIEC 60093
Additional InformationNominal ValueUnitTest Method
Storage: DHDK-0586 BK should be protected from moisture, heat and light. When stored correctly the storage life is 12 months.
ExtrusionNominal ValueUnit
Drying Temperature 60.0°C
Drying Time 2.0 - 6.0hr
Extrusion instructions
HFDK-0586 BK crosslinkable semiconductive compound provides excellent surface finish and output rates. Optimum results are achieved when the processing conditions are optimized for the actual equipment.Pre-drying of the granules to remove moisture is recommended prior to extrusion at 60°C for two to six hours. Extruder barrel settings of 110°C to 125°C are suggested as a starting point while learning to process HFDK-0586 BK.
Note Message
1 .0.40 MPa, measured on crosslinked compression moulded samples.
2 .Measured on crosslinked compression moulded samples.
3 .Measured on crosslinked compression moulded samples.
4 .Measured on crosslinked compression moulded samples.
5 .Measured on crosslinked compression moulded samples.
6 .Measured on crosslinked compression moulded samples.
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