RTP ESD 1391

Category: PPS , Polyphenylene Sulfide
Manufacturer: RTP Company
Trademark: RTP
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: axWap0_RTPESD1391.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
Carbon Fiber - Electrically Conductive
General Information
Filler / Reinforcement
  • Carbon fiber reinforced material, 10% filler by weight
Features
  • Conductivity
RoHS Compliance
  • Contact manufacturer
Processing Method
  • Injection molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.63g/cm³ASTM D792
Molding Shrinkage - Flow (3.20 mm)0.050 - 0.10%ASTM D955
Moisture Content 0.040%
ElectricalNominal ValueUnitTest Method
Static Decay secFTMS 101C 4046.1
Additional InformationNominal ValueUnit
Primary Additive 60%
MechanicalNominal ValueUnitTest Method
Tensile Modulus 41400MPaASTM D638
Tensile Strength 172MPaASTM D638
Tensile Elongation (Yield)0.50%ASTM D638
Flexural Modulus 37900MPaASTM D790
Flexural Strength 283MPaASTM D790
ImpactNominal ValueUnitTest Method
Notched Izod Impact (3.20 mm)43J/mASTM D256
Unnotched Izod Impact (3.20 mm)210J/mASTM D4812
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed)> 260°CASTM D648
ElectricalNominal ValueUnitTest Method
Surface Resistivity
    -- < 1.0E+3ohmsESD STM11.11
    -- < 1.0E+4ohmsASTM D257
Volume Resistivity < 10ohms·cmASTM D257
FlammabilityNominal ValueUnitTest Method
Flame Rating (1.5 mm, ** Values per RTP Company testing.)V-0UL 94
InjectionNominal ValueUnit
Drying Temperature 149°C
Drying Time 6.0hr
Processing (Melt) Temp 307 - 329°C
Mold Temperature 135 - 177°C
Injection Pressure 68.9 - 103MPa
Resin Grade Manufacturer Category Trademark
SLOVAMID® 6 GF 30 FRG 5 Plastcom Nylon 6 SLOVAMID® 6
Braskem PE ES6004 Braskem HDPE Braskem PE
Diamond ABS 3001MC Network Polymers, Inc. ABS Diamond ABS
Plaskon MUF-2C Cookson Electronics - Semiconductor Products Epoxy Plaskon
PERLER® O08U1001B10 A.D. Compound S.p.A. PP Copolymer PERLER®