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EPO-TEK® 430
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | apQLbO_EPO-TEK-430.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 33 | ppm | |
| K+ | > 1 | ppm | |
| Na+ | 5 | ppm | |
| NH4+ | 63 | ppm | |
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 420 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 4.19 | GPa | |
| Weight Loss on Heating | |||
| 200°C | 0.18 | % | |
| 250°C | 0.27 | % | |
| 300°C | 0.45 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 110 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.8E-5 | cm/cm/°C | |
| -- 3 | 1.4E-4 | cm/cm/°C | |
| Thermal Conductivity | 1.3 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 2.5 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Brown | ||
| Density | |||
| Part B | 1.02 | g/cm³ | |
| Part A | 3.55 | g/cm³ | |
| Viscosity 6(23°C) | 300 to 400 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 180 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 86 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Volume Resistivity (23°C) | < 5.0E-3 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 1.0 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| ESENTTIA 60C90ND | Polipropileno del Caribe S.A. | PP Impact Copolymer | ESENTTIA |
| Keltan® 8570C | LANXESS Buna GmbH | EPDM | Keltan® |
| Kepital® FG2025 | Korea Engineering Plastics Co., Ltd | Acetal (POM) Copolymer | Kepital® |
| LNP™ LUBRICOMP™ RX99518 compound | SABIC Innovative Plastics | Nylon 66 | LNP™ LUBRICOMP™ |
| KMI PP KM-7213-PP NCA | KMI Group, Inc. | PP, Unspecified | KMI PP |
