EPO-TEK® H65-175MP

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: ZInRgh_EPO-TEK-H65-175MP.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
General Information
Features
  • Low to No Outgassing
  • Thermally Conductive
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • Military Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
  • MIL Std. 883
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- < 200ppm
    K+ < 50ppm
    Na+ < 50ppm
    NH4+ 38ppm
Particle Size < 20.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 397°CTGA
Die Shear Strength - >20 kg (23°C) 46.9MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 5.63GPa
Thixotropic Index 1.87
Weight Loss on Heating
    200°C 0.10%
    250°C 0.16%
    300°C 0.30%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 100°C
CLTE - Flow
    -- 23.8E-5cm/cm/°C
    -- 31.4E-4cm/cm/°C
Thermal Conductivity 0.79W/m/K
ThermosetNominal ValueUnitTest Method
Shelf Life (-40°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color White
Density 1.68g/cm³
Viscosity 4(23°C)80 to 120Pa·s
Curing Time (180°C)1.0hr
Pot Life 40000min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)95
Lap Shear Strength (23°C)> 13.8MPa
Relative Permittivity (1 kHz)5.30
Volume Resistivity (23°C)> 1.2E+14ohms·cm
Dissipation Factor (1 kHz)0.011
Note Message
1 .Dynamic Cure 20-300°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .2.5 rpm
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