Category: | Adhesive , Adhesive |
Manufacturer: | Cytec Industries Inc. |
Trademark: | FM® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | Z0dBSw_FM-2555.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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FM® 2555 is a 350°F (177°C) cure, 440°F (227°C) post-cure modified cyanate ester film adhesive. This adhesive has good high temperature properties with low dielectric constant and low loss tangent electrical properties. Other products in this cyanate ester family include CYCOM® 5575-2 glass- and quartz- reinforced prepreg, FM® 2525 adhesive and FM® 6555-1 and BR® 6565 syntactic foams. Suggested Applications: Honeycomb sandwich construction Metal-to-metal bonding Composite-to-metal bonding Composite-to-composite bonding 350°F (177°C) cure satellite structure applications |
General Information | |
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Features |
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Uses |
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Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | 232 | °C |
Electrical | Nominal Value | ||
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Dielectric Constant (25°C, 10.0 GHz) | 2.80 |
Additional Information | Nominal Value | Unit | |
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Volatiles | < 1.0 | % |
Note Message | |
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1 . | Dry |
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