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EPO-TEK® T6067-3
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | YlFxBk_EPO-TEK-T6067-3.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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A single component, thermally conductive, electrically insulating epoxy designed for microelectronic packaging and assemblies. It may be used for bonding SMD's, die-attach, substrate-attach or general heat sinking. It is a lower viscosity version of EPO-TEK® T6067. Formerly 93-86 |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 402 | °C | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Weight Loss on Heating | |||
| 200°C | 0.060 | % | |
| 250°C | 0.44 | % | |
| 300°C | 0.90 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature | 109 | °C | |
| CLTE - Flow | |||
| -- 1 | 4.7E-5 | cm/cm/°C | |
| -- 2 | 1.7E-4 | cm/cm/°C | |
| Thermal Conductivity | 1.0 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | White | ||
| Density | 1.80 | g/cm³ | |
| Viscosity 3(23°C) | 130 | Pa·s | |
| Curing Time (150°C) | > 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 89 | ||
| Relative Permittivity (1 kHz) | 3.33 | ||
| Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.011 |
| Note Message | |
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| 1 . | Below Tg |
| 2 . | Above Tg |
| 3 . | 1 rpm |
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