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NuSil EPM-2480

Category:	Silicone , Silicone
Manufacturer:	NuSil Technology
Trademark:	NuSil
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	Yec5Dm_NuSil-EPM-2480.pdf
PRICE:	Order Products email sales@su-jiao.com

Wechat: WECHAT

Message
As a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications. Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chemical and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Gels Comments: Useful for Potting Intricate Assemblies Due to Low Viscosity

Message

As a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications.

Benefits of Silicone for Electronics:

Wide Operating Temperature Range of -115 °C to 250 °C

Low moisture absorption, < 0.4% Typical

Corrosion Resistance

High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm

Fillers can be added to provide thermal and electrical conductive properties

Low Modulus (Typically less than 5.5 MPa/800 psi)

Stable chemical and mechanical properties when exposed to high temperatures

Low Shrinkage

Available as gels, elastomers, film adhesives sheeting, and greases

General Purpose: Gels

Comments: Useful for Potting Intricate Assemblies Due to Low Viscosity

General Information
Features	Good Corrosion Resistance Good Thermal Stability Low Moisture Absorption Low Shrinkage Low Viscosity
Uses	Electrical/Electronic Applications
Forms	Gel
Processing Method	Potting

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	1.0E+14	ohms·cm	ASTM D257

Thermoset	Nominal Value	Unit
Thermoset Components
Part A	Mix Ratio by Weight: 1.0
Part B	Mix Ratio by Weight: 1.0

Additional Information	Nominal Value	Unit
Cure System	Platinum
Ionic Content
Cl	< 5	ppm
K	< 1	ppm
Na	< 2	ppm
Operating Temperature	-65 to 250	°C

Uncured Properties	Nominal Value	Unit
Color	Translucent
Viscosity ¹	3.0	Pa·s
Curing Time (150°C)	0.50	hr
Pot Life	1400	min

Note Message
1 .	Mixed

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