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KYOCERA KE-850SP

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	KYOCERA Chemical Corporation
Trademark:	KYOCERA
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	XhGhXO_KYOCERA-KE-850SP.pdf
PRICE:	Order Products email sales@su-jiao.com

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Message

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound.

Strong Points

High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress.

Used in Auto Molding System by Rapid Cure Grades.

KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K).

Application

Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics.

Packages for High Heating Volume such as Power Module.

General Information
Features	Good Moldability Moisture Resistant Thermally Conductive
Uses	Electrical/Electronic Applications

Physical	Nominal Value	Unit
Specific Gravity	2.19	g/cm³
Spiral Flow	50.0	cm

Thermal	Nominal Value	Unit
Glass Transition Temperature	190	°C
CLTE - Flow
-- ¹	2.1E-5	cm/cm/°C
-- ²	5.9E-5	cm/cm/°C
Thermal Conductivity	2.3	W/m/K

Uncured Properties	Nominal Value	Unit
Gel Time	0.58	min

Note Message
1 .	Alpha 1
2 .	Alpha 2

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