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EPO-TEK® B9126-7
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Xg95ne_EPO-TEK-B9126-7.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A single component, thermally conductive, electrically insulating epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a low temperature cure and syringe dispensing rheology. It can be used for thermal dissipation when bonding chips, SMDs, PCBs or heat sinks. |
| General Information | |
|---|---|
| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 381 | °C | |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 2.85 | GPa | |
| Thixotropic Index | 2.80 | ||
| Weight Loss on Heating | |||
| 200°C | 0.31 | % | |
| 250°C | 0.78 | % | |
| 300°C | 1.9 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 55.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 6.3E-5 | cm/cm/°C | |
| -- 3 | 2.0E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.55 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life 4 | 26 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Yellow | ||
| Density | 1.32 | g/cm³ | |
| Viscosity 5(23°C) | 25 to 35 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 4300 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 77 | ||
| Lap Shear Strength (23°C) | 8.14 | MPa | |
| Relative Permittivity (1 kHz) | 4.21 | ||
| Volume Resistivity (23°C) | > 5.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.016 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Refrigerated |
| 5 . | 10 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| POLYMAN® (ABS) LP 500 RCP | A. Schulman Europe | ABS | POLYMAN® |
| TUFNYL® SGF 30 BLACK | SRF Ltd. | Nylon 6 | TUFNYL® |
| 4MID® 9B21030 H | 4Plas | Nylon 6 | 4MID® |
| Adell Polyamide AT-13 | Adell Plastics, Inc. | Nylon 66 | Adell Polyamide |
| Sylvin 4225-55 Natural | Sylvin Technologies Incorporated | PVC, Unspecified | Sylvin |
